This is a brief video of M.C. Escher’s ‘Impossible Cube’ modeled and 3-D printed in real life by Pierpaolo Andraghetti. It only looks perfect from this one angle. For any other angle the trick of perspective becomes apparent.
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 New package technology improves EMI and thermal performance with smaller solution sizeSponsored by Texas Instruments Power supply designers have a new tool in their effort to achieve balance between efficiency, size, and thermal performance with DC/DC power modules. The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address design challenges with an easy-to-use footprint that resembles a standard QFN. This new package type combines the advantages of flip-chip-on-lead with the improved thermal performance presented by a large thermal die attach pad (DAP). Click here to download the whitepaper |
