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Bi-fuel hybrid camper van drives 1,000 miles and camps on pure battery power

A safety cone-orange Mitsubishi 4×4 camper van would typically be showstopper enough for any motorhome expo booth, but Campers Scotland came out blazing from both hands at this month’s Scottish Caravan, Motorhome & Holiday Home Show, where it also debuted the Eco Explorer. Less rugged but still a 4×4, the hybrid Eco Explorer offers low fuel consumption and a self-charging battery system to keep the lights on and cooktop firing. An LPG option gives it three drive-power sources and up to 1,000 miles (1,600 km) of range per fill-up, while a deconstructed kitchen and sliding rear bench make it a capable everyday driver. [Source]

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featured blogs
Dec 7, 2023
Building on the success of previous years, the 2024 edition of the DATE (Design, Automation and Test in Europe) conference will once again include the Young People Programme. The largest electronic design automation (EDA) conference in Europe, DATE will be held on 25-27 March...
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Explore the different memory technologies at the heart of AI SoC memory architecture and learn about the advantages of SRAM, ReRAM, MRAM, and beyond.The post The Importance of Memory Architecture for AI SoCs appeared first on Chip Design....
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Dramatically Improve PPA and Productivity with Generative AI

Sponsored by Cadence Design Systems

Discover how you can quickly optimize flows for many blocks concurrently and use that knowledge for your next design. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and generative AI features within Cadence Cerebrus Explorer will intelligently optimize the design to meet the power, performance, and area (PPA) goals in a completely automated way.

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3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.

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featured chalk talk

Peltier Modules
Do you need precise temperature control? Does your application need to be cooled below ambient temperature? If you answered yes to either of these questions, a peltier module may be the best solution for you. In this episode of Chalk Talk, Amelia Dalton chats with Rex Hallock from CUI Devices about the limitations and unique benefits of peltier modules, how CUI Devices’ arcTEC™ structure can make a big difference when it comes to thermal stress and fatigue of peltier modules, and how you can get started using a peltier module in your next design.
Jan 3, 2023
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