fresh bytes
Subscribe Now

Baby saved by doctors using Google Cardboard after 3D printer fails

cardboard1.png

When [Cassidy and Chad Lexcen]’s twin daughters were born in August, smaller twin [Teegan] was clearly in trouble. Diagnostics at the Minnesota hospital confirmed that she had been born with only one lung and half a heart. [Teegan]’s parents went home and prepared for the inevitable, but after two months, she was still alive. [Cassidy and Chad] started looking for second opinions, and after a few false starts, [Teegan]’s scans ended up at Miami’s Nicklaus Children’s Hospital, where the cardiac team looked them over. They ordered a 3D print of the scans to help visualize possible surgical fixes, but the 3D printer broke.

Not giving up, they threw [Teegan]’s scans into Sketchfab, slapped an iPhone into a Google Cardboard that one of the docs had been playing with in his office, and were able to see a surgical solution to [Teegan]’s problem. Not only was Cardboard able to make up for the wonky 3D printer, it was able to surpass it – the 3D print would only have been the of the heart, while the VR images showed the heart in the context of the rest of the thoracic cavity.[Dr. Redmond Burke] and his team were able to fix [Teegan]’s heart in early December, and she should be able to go home in a few weeks to join her sister [Riley] and make a complete recovery.
via Hack a Day

Continue reading 

Leave a Reply

featured blogs
Apr 2, 2026
Build, code, and explore with your own AI-powered Mars rover kit, inspired by NASA's Perseverance mission....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Connecting the World Through Space
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
Mar 30, 2026
21,758 views