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Abundant Robotics raises $10 million to commercialize its apple-picking robot

Picking apples may seem like a fun weekend activity, but it’s actually backbreaking manual labor. Abundant Robotics wants to help agricultural growers shoulder this task and today announced funding of $10 million, led by GV, to commercialize its apple-picking robot.

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featured blogs
Nov 30, 2023
No one wants to waste unnecessary time in the model creation phase when using a modeling software. Rather than expect users to spend time trawling for published data and tediously model equipment items one by one from scratch, modeling software tends to include pre-configured...
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See how we're harnessing generative AI throughout our suite of EDA tools with Synopsys.AI Copilot, the world's first GenAI capability for chip design.The post Meet Synopsys.ai Copilot, Industry's First GenAI Capability for Chip Design appeared first on Chip Design....
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Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....

featured video

Dramatically Improve PPA and Productivity with Generative AI

Sponsored by Cadence Design Systems

Discover how you can quickly optimize flows for many blocks concurrently and use that knowledge for your next design. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and generative AI features within Cadence Cerebrus Explorer will intelligently optimize the design to meet the power, performance, and area (PPA) goals in a completely automated way.

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featured paper

3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.

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featured chalk talk

dsPIC33CH DSCs: Two dsPIC33Cs on a Single Chip
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Vijay Bapu from Microchip and Amelia Dalton explore the benefits of dual core digital signal controllers. They discuss the key specifications to keep in mind when it comes to single core and dual core DSCs and how you can reduce your development time, save board space and cost and keep the performance and isolation you need with Microchip’s dsPIC33CH DSCs.
Jan 24, 2023
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