fish fry
Subscribe Now

Boxes to Boards and Back Again

Technology Transitions, VPX, and the Challenges of SoCs in Embedded Design

Consolidation and innovation in embedded design is the name of the game for this week’s Fish Fry. We chat with Ken Grob (Elma Electronics) about VPX, getting your box design onto a board, and the many advantages of implementing a system on chip or system on module in your next embedded design. In a special “This isn’t an April Fools’ joke” edition of News You May Have Missed, we investigate how the foam created by a tiny frog from Trinidad may revolutionize antibiotic delivery. Also this week, we check out the many challenges and alternatives for thermal management.


 

Download this episode (right click and save)

Links for April 1, 2016

More information about Elma Electronic

Using Frog Foam to Deliver Antibiotics 

New Episode of Chalk Talk: Thermal Management

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

OPTIGA™ TPM SLB 9672 and SLB 9673 RPI Evaluation Boards
Sponsored by Mouser Electronics and Infineon
Security is a critical design concern for most electronic designs today, but finding the right security solution for your next design can be a complicated and time-consuming process. In this episode of Chalk Talk, Amelia Dalton and Andreas Fuchs from Infineon investigate how Infineon’s OPTIGA trusted platform module can not only help solve your security design concerns but also speed up your design process as well.
Jun 26, 2023
34,557 views