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Boxes to Boards and Back Again

Technology Transitions, VPX, and the Challenges of SoCs in Embedded Design

Consolidation and innovation in embedded design is the name of the game for this week’s Fish Fry. We chat with Ken Grob (Elma Electronics) about VPX, getting your box design onto a board, and the many advantages of implementing a system on chip or system on module in your next embedded design. In a special “This isn’t an April Fools’ joke” edition of News You May Have Missed, we investigate how the foam created by a tiny frog from Trinidad may revolutionize antibiotic delivery. Also this week, we check out the many challenges and alternatives for thermal management.


 

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Links for April 1, 2016

More information about Elma Electronic

Using Frog Foam to Deliver Antibiotics 

New Episode of Chalk Talk: Thermal Management

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Larsen & Toubro built the world’s largest FIFA stadium in Qatar, the world’s tallest statue, and one of the world’s most sophisticated cricket stadiums. Their latest business venture? Designing data centers. Since IT equipment in data centers generates a lot of heat, it’s important to have an efficient and effective cooling system. Learn why, Larsen & Toubro use Cadence Reality DC Design Software for simulation and analysis of the cooling system.

Click here for more information about Cadence Multiphysics System Analysis

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Electrical Connectors for Hermetically Sealed Applications
Sponsored by Mouser Electronics and Bel
Many hermetic chambers today require electrical pathways to provide internal equipment with power, data or signals, or to receive data and signals from equipment within the chamber. In this episode of Chalk Talk, Amelia Dalton and Brad Taras from Cinch Connectivity Solutions explore the role that seals and connectors play in the performance of hermetic chambers. They examine the methodologies to determine hermetic seal leaks, the benefits of epoxy hermetic seals, and how Cinch Connectivity’s epoxy-based seals and hermetic connectors can add value to your next design.
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