Walk Softly and Carry a Bigger Memory

High Bandwidth Memory Comes Into Its Own

by Amelia Dalton

Watch out HBM, Fish Fry is coming to get ya! In this week’s episode, we take on High Bandwidth Memory with Mike Gianfangna from eSilicon. Mike and I chat about what kind of designs HBM is best suited for, how it compares with the hybrid memory cube, and why terabyte performance may be closer at hand than ever before. We also take a look at the new Synopsys Synplify FPGA design tools.

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Links for March 18, 2016

More information about eSilicon

More information about Custom 2.5D & 3D Packaging / HBM Solutions from eSilicon

New Episode of Chalk Talk: Synplify FPGA Synthesis

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Designing Scalable IoT Mesh Networks with Digi XBee® for Wi-SUN

Sponsored by Mouser Electronics and Digi and Silicon Labs

In this episode of Chalk Talk, Quinn Jones from Digi, Chad Steider from Silicon Labs and Amelia Dalton explore how Wi-SUN Micro-Mesh can reduce cost and simplify deployment for your next IoT mesh network. They also investigate the benefits that Digi XBee solutions bring to these types of networks and how you can jump start your next IoT mesh network design with Silicon Labs and Digi.

Click here for more information about Digi XBee® Wi-SUN® Modules

May 4, 2026

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Walk Softly and Carry a Bigger Memory

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