fish fry
Subscribe Now

Walk Softly and Carry a Bigger Memory

High Bandwidth Memory Comes Into Its Own

Watch out HBM, Fish Fry is coming to get ya! In this week’s episode, we take on High Bandwidth Memory with Mike Gianfangna from eSilicon. Mike and I chat about what kind of designs HBM is best suited for, how it compares with the hybrid memory cube, and why terabyte performance may be closer at hand than ever before. We also take a look at the new Synopsys Synplify FPGA design tools.


 

Download this episode (right click and save)

Links for March 18, 2016

More information about eSilicon

More information about Custom 2.5D & 3D Packaging / HBM Solutions from eSilicon

New Episode of Chalk Talk: Synplify FPGA Synthesis


Leave a Reply

featured blogs
Nov 30, 2021
Explore the history of the chip design process, from the days of Integrated Device Manufacturers (IDMs) to EDA tools and today's era of democratized design. The post Just What Is Democratized Design Anyway? appeared first on From Silicon To Software....
Nov 30, 2021
The demand for smaller electronics devices can be achieved by high-density layers in multi-layer build-up substrates or multi-layered printed circuit boards (PCB). Vias are essential in the design... [[ Click on the title to access the full blog on the Cadence Community site...
Nov 29, 2021
Tell me if you've heard this before, but I'm looking for a Nordic word that has a sufficiently amorphous gestalt to make it confusing to explain in Norwegian....
Nov 8, 2021
Intel® FPGA Technology Day (IFTD) is a free four-day event that will be hosted virtually across the globe in North America, China, Japan, EMEA, and Asia Pacific from December 6-9, 2021. The theme of IFTD 2021 is 'Accelerating a Smart and Connected World.' This virtual event ...

featured video

Design Low-Energy Audio/Voice Capability for Hearables, Wearables & Always-On Devices

Sponsored by Cadence Design Systems

Designing an always-on system that needs to conserve battery life? Need to also include hands-free voice control for your users? Watch this video to learn how you can reduce the energy consumption of devices with small batteries and provide a solution for a greener world with the Cadence® Tensilica® HiFi 1 DSP family.

More information about Cadence® Tensilica® HiFi 1 DSP family

featured paper

Reduce EV cost and improve drive range by integrating powertrain systems

Sponsored by Texas Instruments

When you can create automotive applications that do more with fewer parts, you’ll reduce both weight and cost and improve reliability. That’s the driving force behind integrating electric vehicle (EV) and hybrid electric vehicle (HEV) designs.

Click to read more

featured chalk talk

Complete Packaging for IIoT Devices

Sponsored by Mouser Electronics and Phoenix Contact

Industrial Internet of Things (IIoT) design brings a new level of demands to the engineering team, particularly in areas like thermal performance, reliability, and scalability. And, packaging has a key role to play. In this episode of Chalk Talk, Amelia Dalton chats with Joel Boone of Phoenix Contact about challenges and solutions in IIoT design packaging.

Click here for more information about Phoenix Contact ICS 50 Enclosure System