Show Me The MEMS Money

2015 MEMS Executive Congress Technology Showcase

by Amelia Dalton

It’s that time of year again. When the accelerometers run cold, the gyroscopes start changing colors and float gently to the ground, and the magnetometers tuck themselves in for the long winter ahead. Yes, it’s time for our annual MEMS Executive Congress run down. With a little help from Fish Fry field reporter Larra Morris, we have the scoop on the coolest technologies featured at this year’s MEMS Executive Congress MEMS and Sensor Technology Showcase. From smart baby monitors to the newest in anisotropic magneto-resistive (AMR) sensor technology to the new (and super cool) Bosch eBike, this week’s Fish Fry has a little bit of MEMS action for everyone. Also this week, we check out the details of On Semiconductor’s new MatrixCam Video Development Kit.

Download this episode (right click and save)

Links for November 13, 2015

More information about the 2015 MEMS Executive Congress

More information about the 2015 MEMS Executive Congress MEMS and Sensor Technology Showcase

New Episode of Chalk Talk: MatrixCam Video Developent Kit from ON Semiconductor

Want early design analysis without simulation?

Sponsored by Siemens Digital Industries Software

Traditional verification methods are failing today's complex IC designs, which require a proactive, early-stage analysis approach. A shift-left methodology addresses IP block integration challenges and the limitations of traditional simulation and ERC tools. Insight Analyzer detects hard-to-find leakage issues across power domains, enabling early analysis without full simulation. Identify inefficiencies earlier to reduce rework, improve reliability, and enhance power performance.

Click to read more!

featured chalk talk

CBOT MULTIGIG Transceiver Platform

Sponsored by Mouser Electronics and TE Connectivity

In this episode of Chalk Talk, Anders Thelin from TE Connectivity and Amelia Dalton explore how the CBOT MULTIGIG transceiver platform helps address these challenges with a modular, high-performance approach to rugged, high-density connectivity. We also investigate how this platform supports next-generation system architectures, improves design efficiency, and enables robust performance in even the most demanding environments.

Click here for more information about the TE Connectivity CBOT Evaluation Kit

May 18, 2026

11,669 views

Show Me The MEMS Money

Related