Stacking the Die

FinFETs and the New Age of 3D ICs

by Amelia Dalton

It’s time for the FinFET rubber to meet the road. In this week’s Fish Fry, we look into the issues surrounding FinFET design today. My guest this week is Swami Venkat (Synopsys) and we chat about FinFET adoption (or lack thereof), the specific needs of FinFET design from an EDA point of view, and timing analysis in FinFET designs. Also this week, we check out how and why performance-per-watt will play an increasingly larger (and more important) role in our FinFET designs.

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Links for August 14, 2015

More information FinFET solutions from Synopsys

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featured chalk talk

Designing Scalable IoT Mesh Networks with Digi XBee® for Wi-SUN

Sponsored by Mouser Electronics and Digi and Silicon Labs

In this episode of Chalk Talk, Quinn Jones from Digi, Chad Steider from Silicon Labs and Amelia Dalton explore how Wi-SUN Micro-Mesh can reduce cost and simplify deployment for your next IoT mesh network. They also investigate the benefits that Digi XBee solutions bring to these types of networks and how you can jump start your next IoT mesh network design with Silicon Labs and Digi.

Click here for more information about Digi XBee® Wi-SUN® Modules

May 4, 2026

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Stacking the Die

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