The Touchscreen Revolution

Changing the Face of Electronics One Silver Nanowire (and Blue-Rayed Limpet) at a Time

by Amelia Dalton

What do the blue-rayed limpet and silver nanowires have to do with advances in touchscreen technology? Absolutely everything! This week’s Fish Fry looks into how silver-coated nanowires are changing the touchscreens and OLEDs of today, and could change the film-based solar cells and flexible displays of tomorrow. My guest is Sri Peruvemba from Cambrios, and we discuss the technology behind silver nanowires, how they can be implemented into a variety of designs, and what The Society for Information Display is all about. Also this week, we check out a groundbreaking new study by a team of researchers from MIT and Harvard that looks to harness unique reflective power found in the blue stripes of the blue-rayed limpet to unlock a new kind of transparent display technology.

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Links for March 6, 2015

More information about Cambrios

A highly conspicuous mineralized composite photonic architecture in the translucent shell of the blue-rayed limpet

Dramatically Improve PPA and Productivity with Generative AI

3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.

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featured chalk talk

Package Evolution for MOSFETs and Diodes

Sponsored by Mouser Electronics and Vishay

A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.

Click here for more information about Vishay Semiconductors Signal DFN Package

Jul 10, 2023

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The Touchscreen Revolution

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