What You Call EDA, I Call IP

EDA Past, Present, and Future with Lucio Lanza

by Amelia Dalton

He’s toiled at this project for years – dreamt about it, laid awake at night thinking about it, and even built a lab in his basement to test it. Eventually he brought in friends (from work mostly) to fill in the missing pieces, and before he knew it they really had something. We all know this story. It has played out time and time again. It’s the story of the startup, and today’s Fish Fry celebrates the men and women who work every day with innovation in their hearts and minds. My distinguished guest is Lucio Lanza, an EDA mentor, venture capitalist, and believer in startup innovation. Lucio is here to explain why funding startups is so crucial in today’s EE ecosystem and where he thinks EDA is headed in the future. Also this week, we check out a brand new way to get that semiconductor quote you’ve been looking for without giving you a headache or breaking your fax machine.

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Links for December 19, 2014

EDA Industry to Recognize Dr. Lucio Lanza With the Phil Kaufman Award at ICCAD 2014

New Episode of On the Scene: Almost-Instant Semi Quotes with eSilicon

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

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featured chalk talk

CBOT MULTIGIG Transceiver Platform

Sponsored by Mouser Electronics and TE Connectivity

In this episode of Chalk Talk, Anders Thelin from TE Connectivity and Amelia Dalton explore how the CBOT MULTIGIG transceiver platform helps address these challenges with a modular, high-performance approach to rugged, high-density connectivity. We also investigate how this platform supports next-generation system architectures, improves design efficiency, and enables robust performance in even the most demanding environments.

Click here for more information about the TE Connectivity CBOT Evaluation Kit

May 18, 2026

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What You Call EDA, I Call IP

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