fish fry
Subscribe Now

Don’t Pass Me By

Project Ara Dev Boards and the Internet of Moving Things

The pedal is to the metal, our motor is running, and Fish Fry is hitting the open road. At the wheel this week is mCube CEO Ben Lee. Ben and I discuss the future of the IoT market, the details of mCube’s super tiny accelerometers, and where you can find a truly unique golf course where you play above the clouds. Also joining our Fish Fryin’ caravan this week, is an exciting update from the folks at Google’s Project Ara (and you won’t want to miss this!) Last but certainly not least, we round out this episode with a little ride down Static Timing and Constraint Validation Lane. Buckle up my friends, it’s gonna be a wild ride!

 

 

Download this episode (right click and save)

Links for July 18, 2014

Register for x-fest

More information about Project Ara

Project Ara Dev Board Request

Fish Fry Episode: Google’s Smartphone Revolution – Inside Project Ara

On the Scene – Project Ara

Featured Article by Kevin Morris: Dawn of a new Ara – What’s Google’s New Modular Smartphone Really About?

More information about mCube

New Episode of Chalk Talk – Static Timing and Constraint Validation

More information about x-fest

Leave a Reply

featured blogs
Oct 19, 2020
We'€™re proud to see that many expert verification teams exploit the powers of UVM vr_ad, in implementing intricate verification environments in e . The vr_ad is an open source package, part of UVM- e... [[ Click on the title to access the full blog on the Cadence Communit...
Oct 16, 2020
Another event popular in the tech event circuit is PCI-SIG® DevCon. While DevCon events are usually in-person around the globe, this year, like so many others events, PCI-SIG DevCon is going virtual. PCI-SIG DevCons are members-driven events that provide an opportunity to le...
Oct 16, 2020
If you said '€œYes'€ to two of the items in the title of this blog -- specifically the last two -- then read on......
Oct 16, 2020
[From the last episode: We put together many of the ideas we'€™ve been describing to show the basics of how in-memory compute works.] I'€™m going to take a sec for some commentary before we continue with the last few steps of in-memory compute. The whole point of this web...

Featured Paper

Four Ways to Improve Verification Performance and Throughput

Sponsored by Cadence Design Systems

Learn how to address your growing verification needs. Hear how Cadence Xcelium™ Logic Simulation improves your design’s performance and throughput: improving single-core engine performance, leveraging multi-core simulation, new features, and machine learning-optimized regression technology for up to 5X faster regressions.

Click here for more information about Xcelium Logic Simulation

featured Paper

New package technology improves EMI and thermal performance with smaller solution size

Sponsored by Texas Instruments

Power supply designers have a new tool in their effort to achieve balance between efficiency, size, and thermal performance with DC/DC power modules. The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address design challenges with an easy-to-use footprint that resembles a standard QFN. This new package type combines the advantages of flip-chip-on-lead with the improved thermal performance presented by a large thermal die attach pad (DAP).

Click here to download the whitepaper

Featured Chalk Talk

Cadence Celsius Thermal Solver

Sponsored by Cadence Design Systems

Electrical-thermal co-simulation can dramatically improve the system design process, allowing thermal design adaptation to be done much earlier. The Cadence Celsius Thermal Solver is a complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures. In this episode of Chalk Talk, Amelia Dalton chats with CT Kao of Cadence Design Systems about how the Celsius Thermal Solver can help detect and mitigate thermal issues early in the design process.

More information about Celsius Thermal Solver