fish fry
Subscribe Now

Hackin’ in the Hood

How Boom Boxes Are Inspiring a New Age of Engineers

Do you remember your first EE project? Do you remember the delight in your soul when you first saw that LED light up or that plume of blue smoke rise across the room? In this week’s Fish Fry, we harken back to the days when we were all budding engineers trying to make our circuits work for the first time. My guest is John Weiss, Director of Bayview BOOM. John is here to to introduce us to Bayview BOOM –  a revolutionary program that brings engineering education to the young people of San Francicso’s Bayview/Hunters Point neighborhood. Join John and I as we chat about how Bayview BOOM nurtures cognitive growth, physical activity and a love for electronic design in its students – one boom box at a time. 


 

Download this episode (right click and save)

Links for May 30, 2014

More information about Bayview BOOM


Leave a Reply

featured blogs
Nov 30, 2023
No one wants to waste unnecessary time in the model creation phase when using a modeling software. Rather than expect users to spend time trawling for published data and tediously model equipment items one by one from scratch, modeling software tends to include pre-configured...
Nov 27, 2023
See how we're harnessing generative AI throughout our suite of EDA tools with Synopsys.AI Copilot, the world's first GenAI capability for chip design.The post Meet Synopsys.ai Copilot, Industry's First GenAI Capability for Chip Design appeared first on Chip Design....
Nov 6, 2023
Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....

featured video

TDK CLT32 power inductors for ADAS and AD power management

Sponsored by TDK

Review the top 3 FAQs (Frequently Asked Questions) regarding TDK’s CLT32 power inductors. Learn why these tiny power inductors address the most demanding reliability challenges of ADAS and AD power management.

Click here for more information

featured paper

3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.

Click to read more

featured chalk talk

Addressing the Challenges of Low-Latency, High-Performance Wi-Fi
In this episode of Chalk Talk, Amelia Dalton, Andrew Hart from Infineon, and Andy Ross from Laird Connectivity examine the benefits of Wi-Fi 6 and 6E, why IIoT designs are perfectly suited for Wi-Fi 6 and 6E, and how Wi-Fi 6 and 6E will bring Wi-Fi connectivity to a broad range of new applications.
Nov 17, 2023
1,813 views