EEJournal

fish fry
Subscribe Now
January 14, 2011

Between an ARM and a Hard Place

Fish Fry - January 14, 2011
by Amelia Dalton

In my Fish Fry this week, I examine the new ARM/Microsoft announcement, the squishy ownership of IP in today’s electronic design and how the Verizon iPhone plan will affect smartphone users in the U.S.

Join me for this week’s news wrap-up with my spin on the high-tech news of the week…  

If you like the idea of this new series, be sure to drop a comment in the box below. I appreciate all of your comments so far, and we will be working to enhance the Fish Fry each week – as long as you’re watching.


 

Watch Previous Fish Frys

Fish Fry Links – January 14, 2011

Jim Turley’s article in Embedded Technology Journal: 
Windows Ported to ARM

Bryon Moyer’s article in IC Design and Verification Journal: 
Other People’s Code – You Down with OPC?

Telecoms Without Borders – Overview

Telecoms Without Borders – Technology

Robot Haiku: Poems for Humans to Read Until Their Robots Decide It’s Kill Time

Haiku Poetry

Leave a Reply

featured blogs
Sci-Fi and Fantasy Books They Should Make into Movies
May 6, 2026
Hollywood has struck gold with The Lord of the Rings and Dune'”so which sci-fi and fantasy books should filmmakers tackle next?...
More from Max's Cool Beans...

featured paper

Want early design analysis without simulation?

Sponsored by Siemens Digital Industries Software

Traditional verification methods are failing today's complex IC designs, which require a proactive, early-stage analysis approach. A shift-left methodology addresses IP block integration challenges and the limitations of traditional simulation and ERC tools. Insight Analyzer detects hard-to-find leakage issues across power domains, enabling early analysis without full simulation. Identify inefficiencies earlier to reduce rework, improve reliability, and enhance power performance.

Click to read more!

featured chalk talk

CBOT MULTIGIG Transceiver Platform
Sponsored by Mouser Electronics and TE Connectivity
In this episode of Chalk Talk, Anders Thelin from TE Connectivity and Amelia Dalton explore how the CBOT MULTIGIG transceiver platform helps address these challenges with a modular, high-performance approach to rugged, high-density connectivity. We also investigate how this platform supports next-generation system architectures, improves design efficiency, and enables robust performance in even the most demanding environments.
Click here for more information about the TE Connectivity CBOT Evaluation Kit
May 18, 2026
11,669 views