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Three Companies, One Toolchain: The Rise of TASKING 3.0

I don’t like change. I know I’m starting to sound like an old codger, but that’s OK because I am an old codger (I know the secret handshake and I have the ceremonial undergarments T-Shirt to prove it). For example, I remember going to the Design Automation Conference (DAC) year after year throughout the 1980s. The same companies were there each time, but it … Read More → "Three Companies, One Toolchain: The Rise of TASKING 3.0"

Well, Fork Me with a Dining Philosophers Problem (or The Best Way to Debug Embedded Systems)

There are many difficult-to-answer questions. For example: At what point does ‘a few’ become ‘several’ When does ‘soon’ become ‘never’? How long will this take? (How long have you got?) When will it be done? (Define ‘done’?) Is it backward compatible? (With what, exactly?) How many devices around the world are running code no one fully understands? How many engineers are currently Googling the same error message? Why are … Read More → "Well, Fork Me with a Dining Philosophers Problem (or The Best Way to Debug Embedded Systems)"

Tensilica HiFi iQ DSP: Voice AI Meets Immersive Automotive Audio

In this week’s podcast, Amol Borkar from Cadence and I explore the major trends in high-performance audio and voice AI. We also investigate how the demanding new use cases in automotive are dramatically increasing audio workloads and how Tensilica HiFi iQ DSP is addressing the increasing requirements for voice AI and immersive audio.

 

Read More → "Tensilica HiFi iQ DSP: Voice AI Meets Immersive Automotive Audio"

Physical AI at Foundry Scale

When conversations turn to semiconductor foundries, they typically begin with leading-edge process nodes and the race toward ever-smaller geometries. However, although nanometer bragging rights dominate headlines, something quieter—and arguably more consequential—is unfolding elsewhere in the industry.

The reason for my newfound perspective is that I was just chatting with James Prior, who is a Marketing Executive at < … Read More → "Physical AI at Foundry Scale"

Beyond the Spherical Chicken: Rewriting Maxwell for Modern Machines

This is going to be a story in three parts. If we’re lucky, they’ll be related, but I’m not making any promises. Let’s start by discussing one of the things I know nothing about. Yes, I know this is a long (and ever-growing) list, but in this case, I’m thinking about the design and analysis of antennas and radar systems.

The closest … Read More → "Beyond the Spherical Chicken: Rewriting Maxwell for Modern Machines"

Chiplets Get Physical: The Days of Mix-and-Match Silicon Draw Nigh

Things continue to gain traction in “chiplet space” (where no one can hear you scream). In fact, before I forget, Chiplet Summit 2026 takes place in just a couple of weeks as I pen these words. The organizers say this is the place to “see and be seen” if you are in any way dabbling your toes in the chiplet waters (I’m paraphrasing, … Read More → "Chiplets Get Physical: The Days of Mix-and-Match Silicon Draw Nigh"

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Mar 9, 2026
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chalk talks
Speed Matters: Methods and Methodologies to Get the Most Performance — Siemens  In this episode of Chalk Talk, Ludovic Jacomme from Siemens and Amelia Dalton investigate the benefits that Siemens Veloce proFPGA CS can bring to your next FPGA-based prototyping project and how you can take advantage of this solution today. Click here for more information about Veloce proFPGA CS QUAD/HEXA Desktops
Time to first prototype shouldn’t be so hard! — SiemensIn this episode of Chalk Talk, Romain Petit from Siemens and Amelia Dalton examine the challenges of FPGA-based prototyping and how the automatic partitioning, automatic cabling, runtime and debug infrastructure and more of the Siemens VPS platform can make your next FPGA-based prototype project easier than ever before. Click here to read the whitepaper called … Read More → "Time to first prototype shouldn’t be so hard! — Siemens"
Driving innovation in 3D IC Design: Siemens Calibre MultiPhysics Work Flow — Siemens  In this episode of Chalk Talk, John Ferguson from Siemens and Amelia Dalton explore how we can drive 3D IC innovation with Siemens Calibre MultiPhysics Work Flow. They also investigate the implications of thermal issues on 3D IC design, the benefits of multiphysics simulations from the concept stage throughout the design cycle, and the … Read More → "Driving innovation in 3D IC Design: Siemens Calibre MultiPhysics Work Flow — Siemens"
Insight Analyzer: Design-Driven Reliability Verification — Siemens  In this episode of Chalk Talk, Matthew Hogan from Siemens and Amelia Dalton explore how Siemens Insight Analyzer can help designers identify and address design-specific potential circuit reliability failure areas. They also examine how Insight Analyzer redefines comprehensive circuit verification and can be a compelling addition to “shift-left” strategy. Click here to download the … Read More → "Insight Analyzer: Design-Driven Reliability Verification — Siemens"
Accelerating Time to Fault Campaign Success with Siemens EDA — Siemens  In this episode of Chalk Talk, Ann Keffer and Robert Serphillips from Siemens and Amelia Dalton explore how the Siemens EDA functional safety platform can guide your team through the complete ISO 26262 lifecycle. They also examine the benefits that the Veloce Fault App brings to automotive IC designs and how you can take … Read More → "Accelerating Time to Fault Campaign Success with Siemens EDA — Siemens"
FPGA-based Prototyping with the Latest High-Capacity FPGA Enables New Use Modes – Siemens  FPGA-based prototyping is an essential tool for any SoC and digital chip design and verification. In this episode of Chalk Talk, Juergen Jaeger from Siemens and Amelia Dalton explore the multitude of benefits of the Veloce proFPGA CS platform from Siemens. They also investigate the debug capabilities, software prototyping and scalable hardware of this … Read More → "FPGA-based Prototyping with the Latest High-Capacity FPGA Enables New Use Modes – Siemens"