In this episode of Chalk Talk, John Ferguson from Siemens and Amelia Dalton explore how we can drive 3D IC innovation with Siemens Calibre MultiPhysics Work Flow. They also investigate the implications of thermal issues on 3D IC design, the benefits of multiphysics simulations from the concept stage throughout the design cycle, and the steps included in the Siemens fully automated MultiPhysics Work Flow.

Click here to read the whitepaper called “Conquer 3D IC thermal impacts with Calibre 3DThermal”: