editor's blog
Subscribe Now

Netlogic Integrates Families

We looked at many-core processors recently, and one of the big issues with scaling up the processor count is memory access: if all of those cores need access to the same memory, then that bandwidth becomes the bottleneck. Which makes SMP with many cores very difficult without shared distributed memory structures.

Netlogic has just announced their XLP II family, following on the heels of their XLP processors that have been around for a while. XLP devices go up to 32 CPUs; XLP II goes up to 80 per device, clusterable to 640. And they explicitly claim SMP capability.

So I followed up with them to see how they manage to talk to memory fast enough to feed so many cores. And it bears saying that, assuming each core manages a different memory, it’s “only” 80 cores that have to vie for attention by a single memory manager. Their response was that they have plenty of headroom on their current 32-CPU devices, and the memory manager runs much faster on the new devices, so they believe that memory access will not get in the way.

As to running all 640 together, they have an inter-chip coherency interface to keep all processors and caches in sync. They have a tri-level caching system, although details aren’t available yet.

They are also claiming a “third-generation” inter-process messaging system to speed up the conversations that the CPUs will need to have with each other.

Above and beyond just the many-core aspects, they are also integrating a host of communication-related functions alongside, including their NETL7 knowledge-based processor, which we discussed recently.

Most technical details haven’t been made public, but there is more info on their press release.

Leave a Reply

featured blogs
Apr 19, 2024
In today's rapidly evolving digital landscape, staying at the cutting edge is crucial to success. For MaxLinear, bridging the gap between firmware and hardware development has been pivotal. All of the company's products solve critical communication and high-frequency analysis...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
Apr 18, 2024
See how Cisco accelerates library characterization and chip design with our cloud EDA tools, scaling access to SoC validation solutions and compute services.The post Cisco Accelerates Project Schedule by 66% Using Synopsys Cloud appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

Industrial Internet of Things (IIoT)
Sponsored by Mouser Electronics and Eaton
In this episode of Chalk Talk, Amelia Dalton and Mohammad Mohiuddin from Eaton explore the components, communication protocols, and sensing solutions needed for today’s growing IIoT infrastructure. They take a closer look at how Eaton's circuit protection solutions, magnetics, capacitors and terminal blocks can help you ensure the success of your next industrial internet of things design.
Jun 14, 2023
35,214 views