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Atmel Introduces Turnkey Security Modules for Femtocells, Smart Meters, Telehealth, USB Token and Gaming Platforms

VaultIC460 first to provide hardware and firmware solution with multiple interfaces for Embedded Security

CARTES, France, Nov. 16 /PRNewswire-FirstCall/ — Atmel® Corporation (NASDAQ:ATML) today announced its new VaultIC(TM) family of security modules for applications including femtocells, smart meters, telehealth, USB token and gaming platforms. The VaultIC460 is the first security module available on the market that provides a secure microcontroller with multiple interfaces and bundled firmware. Based on Atmel’s AT90SO secureAVR® microcontrollers, this new family enables higher levels of security and provides a secure turnkey solution for system designers. The VaultIC460 provides 128 … Read More → "Atmel Introduces Turnkey Security Modules for Femtocells, Smart Meters, Telehealth, USB Token and Gaming Platforms"

Mitrionics Presents Early Scaling Results for Portable Parallel Code on FPGAs, Multi-Cores and Clusters at SC09

 

SUPERCOMPUTING 2009, Portland, OR, November 16, 2009 – Mitrionics, Inc, the technology leader in FPGA-based hybrid computing, today announced its experimental work on a new proof-of-concept compiler for portable parallel programming. Early scalability results will be presented in a talk at SC09 by Mitrionics’ Co-Founder and Chief Science Officer Stefan Möhl. The proof-of-concept compiler is a test-bench to prove that a Mitrion-C program will automatically scale, not only on FPGAs, but also on multi-core systems and clusters, without changing the source code between the radically diverse architectures. Mitrion-C as a commercial product has already been proven … Read More → "Mitrionics Presents Early Scaling Results for Portable Parallel Code on FPGAs, Multi-Cores and Clusters at SC09"

Xilinx’s New EasyPath-6 FPGAs Deliver Fast, Simple, Risk-Free Cost Reduction for High-Performance Virtex-6 FPGAs in Just Six Weeks

EasyPath-6 FPGAs Deliver the Lowest Total Product Cost for 40-nm FPGAs in the Shortest Time with No Risk and Complete Support for all FPGA Features

SAN JOSE, Calif., Nov. 16 — Xilinx, Inc. (NASDAQ:XLNX) today announced EasyPath(TM)-6 FPGAs, offering the industry’s lowest total cost with the lowest-risk from high-performance FPGA to production ready devices in just six weeks, the fastest turnaround time of any FPGA cost reduction solution. The new version of EasyPath FPGAs also does not require minimum order quantities, enabling customers to tailor their shipments to their end-market needs, and delivers a 35 … Read More → "Xilinx’s New EasyPath-6 FPGAs Deliver Fast, Simple, Risk-Free Cost Reduction for High-Performance Virtex-6 FPGAs in Just Six Weeks"

Actel Strengthens Fusion Mixed-Signal FPGA IP Offering For xTCA Platform Management Applications

MOUNTAIN VIEW, Calif., November 16, 2009– Actel today announced IP core enhancements for hardware platform management applications. Developed in close collaboration with Pigeon Point Systems, an Actel company, the new and improved cores further strengthen the suitability of Actel Fusion® mixed-signal FPGAs for platform management applications, and especially xTCA(TM) applications, for which Pigeon Point offers the market-dominant Board Management Reference (BMR) series.

“These DirectCore enhancements further demonstrate the benefits of using Fusion mixed-signal FPGAs for local xTCA management controllers,” said Mark Overgaard, president of Pigeon Point Systems. “These enhancements demonstrate the continuing investment by Actel and … Read More → "Actel Strengthens Fusion Mixed-Signal FPGA IP Offering For xTCA Platform Management Applications"

Lattice Announces Production Release Of Highest Density LatticeECP3 FPGA

— LatticeECP3-150 FPGA is Ideal for High-volume, Low-cost 3G Basestation Designs — 

HILLSBORO, OR — NOVEMBER 16, 2009 — Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced that the LatticeECP3™-150 FPGA, the highest-density device in its award-winning high-value, low-power ECP3 mid-range FPGA family, has been fully qualified and released to volume production. 
The ECP3-150 device features a DSP capacity of 320 18×18 multipliers, 6.8 Mbits of memory and up to sixteen 3.2Gbps SERDES channels, making it ideally suited for highly complex and integrated Wireless Remote Radio Heads (RRH) such as MIMO-based RF antenna solutions. The ECP3-150 FPGA also … Read More → "Lattice Announces Production Release Of Highest Density LatticeECP3 FPGA"

Digital Imaging Systems achieves first-pass silicon success with Synopsys Galaxy Custom Designer

Demanding AMS project design and tapeout schedule met in 22 days

MOUNTAIN VIEW, Calif., November 16, 2009 – Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that Digital Imaging Systems GmbH (DIS) has achieved first-pass silicon success using Synopsys’ Galaxy Custom Designer(TM) implementation solution and its unified suite of circuit simulation, extraction and physical verification tools for a custom integrated circuit (IC) used in DIS’ high performance, multi-megapixel camera modules. The productivity enhancements afforded by Custom Designer, combined with its interoperable and open environment, … Read More → "Digital Imaging Systems achieves first-pass silicon success with Synopsys Galaxy Custom Designer"

Ericsson¹s ultra optimized DC/DC module provides more power and higher efficiency than predecessor

Based on a cost optimized platform that has contributed to make Ericsson
Power Modules¹ quarter-brick PKM-E series one of the most successful
throughout the world, and now using a combination of further optimized
topology and advanced components, the 24V input PKM2810EPI delivers 65% more
power that its predecessor, while improving efficiency up to 92.5% at
half-load and 89.5% at full-load.

The PKM2810EPI is a 3.3V/25A output module delivering up to 82.5W. The
module is the first in the second generation of PKM2000EPI, complementing
Ericsson Power Modules¹ … Read More → "Ericsson¹s ultra optimized DC/DC module provides more power and higher efficiency than predecessor"

connectBlue™ Presents an All-Inclusive Bluetooth 2.1+EDR Module

The connectBlue range of wireless OEM modules has been extended with a new Bluetooth 2.1+ EDR module that implements leading-edge chip technology from STMicroelectronics, one of the world’s largest semiconductor companies, and ST-Ericsson, a world leader in wireless semiconductors and mobile platforms.

In addition to the acclaimed connectBlue features of high performance and robustness, the new full-fledged module provides the customer with complete development flexibility. This flexibility is achieved by the integrated development platform within the actual module. The platform is aimed at user specific application software opening up new application possibilities as well as … Read More → "connectBlue™ Presents an All-Inclusive Bluetooth 2.1+EDR Module"

Avnet, TI and Xilinx Launch Analog eLab™ Videocast Series

New Series Features Digital Power Techniques for Meeting Power Requirements for Xilinx Spartan®-6 and Virtex®-6 Product Families

PHOENIX — November 12, 2009 — The Avnet Electronics Marketing operating group of Avnet, Inc. (NYSE: AVT), Texas Instruments (TI) and Xilinx® have launched a new multipart videocast series emphasizing TI’s Fusion Digital Power™ solutions for the latest generation of Xilinx field-programmable gate arrays (FPGAs). This new Analog eLab™ Videocast series features engineering subject matter experts from Avnet, TI and Xilinx discussing a myriad of design topics, in a round-robin format, and utilizing TI’ … Read More → "Avnet, TI and Xilinx Launch Analog eLab™ Videocast Series"

Avnet, TI and Xilinx Launch Analog eLab™ Videocast Series

New Series Features Digital Power Techniques for Meeting Power Requirements for Xilinx Spartan®-6 and Virtex®-6 Product Families

PHOENIX — November 12, 2009 — The Avnet Electronics Marketing operating group of Avnet, Inc. (NYSE: AVT), Texas Instruments (TI) and Xilinx® have launched a new multipart videocast series emphasizing TI’s Fusion Digital Power™ solutions for the latest generation of Xilinx field-programmable gate arrays (FPGAs). This new Analog eLab™ Videocast series features engineering subject matter experts from Avnet, TI and Xilinx discussing a myriad of design topics, in a round-robin format, and utilizing TI’ … Read More → "Avnet, TI and Xilinx Launch Analog eLab™ Videocast Series"

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