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Introducing the Avnet TI OMAP/Spartan-6 FPGA Co-Processing Kit

FPGA-based co-processing is 15X faster than traditional processor/DSP systems. Conventional system design methods face stiff challenges to meet the requirements of today’s ultra-high performance applications. This video explains how the TI OMAP/Spartan-6 FPGA Co-Processing Kit delivers breakthrough system performance by integrating and optimizing the key strengths of high performance FPGAs, system control processing, and digital signal processing, all within one single environment.

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Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

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Connecting the World Through Space
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In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
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