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Conduction Cooling Augments Legacy PC/104 Market

September 14, 2010; San Francisco, Calif. — Diamond Systems Corp., a leading supplier of ruggedizedsingle-board computers (SBCs) and expansion modules for real-world applications, launched today at theIntel Developer Forum (IDF) the Aurora single board computer (SBC) as a much-needed technologicalTMbreakthrough in small form factor (SFF) embedded computing. Featuring the 1.6GHz Atom Z530processor from Intel, Aurora combines US-based rugged design know-how with advanced manufacturingprocess techniques to achieve a rich feature set in the tiny 3.6×3.8″ PC/104 form factor. Best of all, Aurorauses a simple yet unprecedented thermal design among stackable SBCs to reduce size, weight and powerand cost (SWaPaC) compared to legacy VME and PC/104 SBCs.

“With the end-of-life of the 855 chipset in all formfactors, popular Pentium® M and Celeron® M SBCsneed to be replaced with power-efficient Atom-classproducts,” said Colin McCracken, vice president ofmarketing at Diamond Systems. “Featuringconduction cooling, Diamond’s new Aurora SBCstretches program budgets by providing anunmatched feature set. Half the size, weight, powerAND cost is a compelling migration value proposition.For basic command, control, data collection, portable,vehicle upgrade and communications applications, thedays of $1,000+ mid-range rugged SBCs arenumbered thanks to Aurora’s perfect-fit solution.”

Aurora combines the 1.6GHz Atom Z530 processor with SODIMM RAM up to 2GB, Gigabit Ethernet, USBFlashdisk, Serial ATA (SATA), four RS-232 serial ports (two with RS-422/485 capability), four USB 2.0ports, PS/2 keyboard and mouse, and both SUMIT-A and PC/104 ISA bus expansion. Prior to Aurora, thisextensive feature set was typically accomplished by two-board stacks or SBCs with “wings” (form factorexcursions). Compared to COM Express® modules which require +12V input and full custom carrier carddesigns, Aurora saves power by operating off a single low voltage +5V input, yet still allows I/Ocustomization in the form of a plug-in SUMIT module. Diamond supports Windows® Embedded Standardand Linux® 2.6 operating systems.

Rugged features include -40 C to +71 C operation and an innovative new SO-DIMM solution with optionalmounting holes for ruggedness. Diamond’s rugged RAM offering will be manufactured by multipleembedded suppliers. The on-board SATA connector interfaces to SSDs with short 3″ latching cables and noneed for external SATA convertor. Diamond chose to convert IDE (PATA) to SATA on-board since IDEdrives are EOL and SSDs are at risk of higher prices and shorter lifecycle compared to 2.5″ SATA SSDs.Conduction cooling is the ideal solution for sealed (waterproof / dustproof) metal enclosures in order toprevent thermal runaway and maximize the reliability and longevity of electronics.

Aurora is well suited as a basic x86 controller for a range of applications. SUMIT-A is a space-efficientinterface for PCI Express x1, USB, LPC and I2C buses. The combination of SUMIT and PC/104 expansioninterfaces is on a growth trajectory to support the largest overall ecosystem of stackable I/O cards, as PCIchips are becoming EOL in favor of PCI Express chips. System OEMs who use PC/104 I/O cards can nowcontinue to use such cards without having to increase their stack height with a bridge card, or completely re-engineer their software and stack for PCI-based I/O cards.

Supported operating systems currently include Windows XP and Linux 2.6, with support for additional OSesand RTOSes (real-time OSes) available on request.

Pricing and Availability

Aurora samples are shipping within 30 days. Aurora pricing in OEM volumes starts in the upper $400s.

About Diamond

Founded in 1989, Diamond Systems was an early adopter of PC/104 technology and today is one of theleading worldwide suppliers of PC/104 I/O modules and highly integrated single board computers combiningCPU and data acquisition on a single board. Diamond Systems is leading a paradigm shift in embeddedcomputing offering perfect-fit system solutions. Our single board computers use conduction-cooling heatspreaders instead of traditional heat sinks for improved thermal dissipation and increased reliability.Expansion I/O modules can easily be stacked above the SBC or can even be inserted between boards inthe stack. Privately held, Diamond Systems is based in Mountain View, California, in the heart of SiliconValley.

For more information, visit www.diamondsystems.com or call 1-800-36-PC104.

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