feature article
Subscribe Now

Touch-Screen Automation, Simplified

New generations of consumer devices with continuous connectivity, rich graphics, and touch screen interfaces are raising expectations in automation market segments serving factories, buildings and homes. Developers face the challenges of minimizing cost and time to market while meeting the requirements of specialized automation markets. This article by Fabio d’ASlessi, CTO of M31 subsidiary Si14, provides a case study that illustrates how modular solutions based on the Intel® Atom™ processor and the Si14 Sensor and Actor Network (SAN) Framework can help developers innovate new Web-enabled and Web-controlled automation solutions more quickly and easily.  

The Si14 Sensor and Actor Network (SAN) Framework is a combination of hardware and software modules for industrial automation. On the software side, the solution builds on the Nokia Qt framework to provide a set of high-level design tools, APIs, and interfaces. The Intel Atom processor was chosen for its low power consumption, wired and wireless connectivity and robust graphic capabilities. The processor also enables simplified software development, thanks to binaries that can run unmodified on a desktop PC or low-power embedded devices.  

The solution includes gateways based on standard technologies such as XML, JavaScript Object Notation (JSON) and RESTful Web services. This provides a unifying platform that flexibly interfaces with multiple existing frameworks and the majority of home and industrial standard radio or wired buses and protocols such as Ethernet, Wi-Fi, RS232 and RS485, CAN, ZigBee.  Developers can easily integrate additional components, architectures and technologies. The Si14 solution includes graphic software modules based on multi-touch screens used to configure and control the system. The SAN Framework is Web-enabled, allowing the sensors and actors to be exposed on the Internet through SCADA-specific interfaces for remote monitoring and control. The system can also interact with Web-based machine-to-machine (M2M) services through standard JSON and RESTful interfaces. 

Leave a Reply

featured blogs
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Improving Chip to Chip Communication with I3C
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Amelia Dalton and Toby Sinkinson from Microchip explore the benefits of I3C. They also examine how I3C helps simplify sensor networks, provides standardization for commonly performed functions, and how you can get started using Microchips I3C modules in your next design.
Feb 19, 2024
10,027 views