Deggendorf, Germany, July 06, 2010 * * * congatec AG expands its COM Express product range with the high performance conga-BS57 module. Featuring the latest Intel® low-power processors in a small form factor (SFF) BGA package, it is particularly suited for shock resistant applications.
Depending on the application, the conga-BS57 utilizes a range of processors starting with Intel® Celeron® U3400 processor (4MB Cache, 1.06 GHz, TDP 18 Watt) up to the
Intel® Core™ i7-620 LE processor (4MB Cache, 2.0 GHz, TDP 25 Watt).
The conga-BS57 features the Mobile Intel® HM55 Express Chipset which measures only 25 x 27 mm and provides a powerful, compact two-chip solution with support for up to 8GByte (1066 MT/s) dual channel DDR3 memory.
The integrated graphics controller supports the Intel® Flexible Display Interface (FDI) thereby enabling two independent video channels on VGA, LVDS, HDMI, DisplayPort and SDVO interfaces.
Thanks to the use of energy-efficient processors, the type 2 pin-out conga-BS57 provides high performance graphics. Compared to previous generations of Intel® integrated graphics, 3-D performance has been significantly improved. Coupled with the additional computing power of the Intel® Core™ i7 processor, the conga-BS57 is an ideal solution for low-power, graphics-intensive applications such as those often found in the gaming market or in medical imaging systems.
The integrated Intel® Turbo Boost Technology can overclock a processor core if the second core operates at low capacity. congatec benchmark tests have shown that it is possible to boost the computational power of a processor core by up to 25% when using this technology.
To keep power consumption at about the same level as earlier processor generations, the Intel® Core™ i7 processor supports the latest low-power modes. Through the use of the Intel® Core™ C6 state, where the processor status is stored in a dedicated SRAM, the cores can be switched off, reducing power consumption to almost zero. The fact that the individual cores can assume C6 status independently of one another further helps to increase power efficiency.
Five PCI express lanes, eight USB 2.0 ports, three SATA ports, EIDE and oneGigabit Ethernet Gigabit Ethernet interface enable flexible system extensions while offering higher data bandwidths. An LPC bus is available for slower expansions as well as a fan controller and Intel® High Definition Audio interface to round off the complete feature set.
Availability
Samples are available now.
About congatec AG
congatec AG has its head office in Deggendorf in Bavaria. It is an innovative business that specializes in the development and marketing of industrial computer modules using the standard form factors Qseven, COM Express, XTX and ETX. With this focus and annual revenue of 26 million euros (2009), congatec is today a leading manufacturer in this field. The company’s products can be used in a variety of industries and applications, such as industrial automation, medical technology, automotive supplies, aerospace and transportation. Core knowledge and technical know-how includes unique extended BIOS features as well as comprehensive driver and board support packages. Following the design-in phase, customers are given support via extensive product lifecycle management. The company’s products are manufactured by specialist service providers in accordance with modern quality standards. congatec currently has 80 employees and has branch offices in Plze? and Brno/Czech Republic, Taipei/Taiwan and San Diego/USA. More information is available on our website at www.congatec.com
