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Xilinx 7 Series FPGAs Slash Power Consumption by 50% and Reach 2 Million Logic Cells on Industry’s First Scalable Architecture

SAN JOSE, Calif., June 21 /PRNewswire/ — Xilinx, Inc. (NASDAQ:XLNX) today announced the industry’s first FPGA series that slashes total power consumption by 50 percent and offers industry-leading capacity of up to 2 million logic cells on the only unified architecture that scales across low-cost to ultra high-end families. Xilinx® 7 series FPGAs further extend the range of applications programmable logic can address by breaking new ground in solving customer challenges for lower power and cost without compromising on higher capacity and increased performance. Implemented on 28-nanometer (nm) process technology optimized to deliver low power with high performance, the new families enable significant levels of productivity as skyrocketing development costs, complexity, and inflexibility of alternative ASIC and ASSP technology make FPGA platforms more relevant to an increasingly diverse community of designers.

The 28nm families extend Xilinx’s Targeted Design Platform strategy introduced with the company’s 40nm Virtex®-6 and 45nm Spartan®-6 FPGA families, now in volume production. The Targeted Design Platform strategy combines FPGAs, ISE® Design Suite software tools and IP, development kits, and targeted reference designs to enable customers to leverage their existing design investments and reduce their overall costs as they meet evolving market needs. In this new generation, Xilinx also takes a critical next step in its work to dramatically expand the ecosystem of available IP and designs that enable customers to focus on differentiation even as they transition to 28nm devices.

“The 7 series represents a new juncture for Xilinx, and the FPGA industry in general, as we bring our technology portfolio to new markets by putting a significant emphasis on lowering power consumption,” said Xilinx President and CEO Moshe Gavrielov. “In addition to delivering what we and our customers expect from Moore’s Law in terms of capacity and performance with each new generation, we continue our focus on opening programmable logic to a broader audience by delivering design platforms targeted toward the specific needs of new users and markets.”

Delivering the Industry’s Lowest Power 28nm FPGAs

The new FPGA families enable developers to implement programmable solutions in a range of systems that had previously only been achievable in ASSPs or ASICs, including portable ultrasound equipment consuming less than 2 watts and automobile infotainment systems driven by 12 volts, as well as low-cost LTE baseband and femtocell base stations.

Xilinx placed an intense focus on minimizing total power by adopting a unique HKMG (high-K metal gate) process optimized for low static power consumption (see “Xilinx Picks 28nm High-Performance, Low-Power Process to Accelerate Platforms for Driving the Programmable Imperative”). Working with its foundry partners, Xilinx helped define the new process to achieve FPGA performance requirements, while lowering static power consumption by 50 percent compared to the alternative 28nm high-performance process. Xilinx then applied innovative architectural enhancements to lower dynamic power consumption both for logic and I/O, while also introducing intelligent clock-gating technology with the release of ISE Design Suite 12. The result is an FPGA series that provides 50 percent lower total power consumption compared to Virtex-6 and Spartan-6 FPGAs and 30 percent lower than alternative 28nm FPGA device families.

The significantly lower power consumption not only enables FPGAs to target new applications, it also allows Xilinx to deliver the most usable performance in the 28nm generation of devices. This means designers can take full advantage of up to 4.7TMACS (trillion multiply accumulates per second) in DSP performance symmetric mode (2.37TMACS in non-symmetric mode) and 2 million logic cells at clock speeds of up to 600MHz, and achieve up to 2.4Tbps high-speed connectivity all while staying within their power budgets.

New Unified Architecture Enables Scalability and Increases Productivity

All 7 series FPGAs share a unified architecture that enables customers to easily scale their designs up or down in capability to reduce cost and power or increase performance and capability, thereby reducing their investment in developing and deploying products across low-cost and high-performance families. The architecture is derived from the widely successful Virtex-series-based architecture and has been designed to simplify reuse of current Virtex-6 and Spartan-6 FPGA designs. It is also supported by the proven EasyPath™ FPGA cost reduction solution that further improves productivity by enabling a guaranteed 35 percent cost reduction with no incremental conversion or engineering investment.

Customers who need the lower power or increased system performance and capacity provided in the new 7 series FPGAs can begin designs in Virtex-6 and Spartan-6 FPGAs with the confidence that they can move their designs when the time is right. This unified architecture is facilitated by Xilinx’s adoption of the AMBA AXI interconnect standard enabling plug-and-play IP usage to help customers improve productivity and development costs.

“Integrating 6-LUT architecture and working with ARM on the AMBA specification for these devices supports IP reuse, portability, and predictability,” said Andy Norton, CTO for Systems Architecture, Cloudshield Technologies, an SAIC company. “A unified architecture, new paradigm-changing processor-centric devices and hierarchical-based design flows in next-gen tools, will result in increased productivity, flexibility, system-on-chip capabilities and portability from previous generation architectures.”

The devices use the same logic architecture, Block RAM, clocking technology, DSP slices, and SelectIO™ technology and build on previous generations of devices delivered by Xilinx’s patented Virtex series ASMBL™ block architecture. This next generation ASMBL architecture provides unprecedented flexibility and scalability that enables customers to most effectively utilize the full range of logic densities.

Introducing the New Xilinx 7 Series FPGA Families:

  • Virtex-7 Family: Delivering a 2X system performance improvement at 50 percent lower power compared to Virtex-6 devices, the ultra high-end Virtex-7 family sets new industry benchmarks with 1.8X greater signal processing performance, 1.6x greater I/O bandwidth, 2X greater memory bandwidth with 2133 Mbps memory interfacing performance, and delivers the industry’s largest density FPGA with 2 million logic cells, which is 2.5X greater density than any previous or existing FPGA. EasyPath-7 devices are also available for all Virtex-7 FPGAs for a guaranteed 35% cost reduction without requiring any design conversion. Virtex-7 devices enable 400G bridging and switch fabric wired communication systems that are at the heart of the global wired infrastructure, advance RADAR systems, and high-performance computer systems that require single-chip TeraMACC signal processing capabilities, as well as the logic density, performance, and I/O bandwidth required for next generation test and measurement equipment. The Virtex-7 family will include “XT” extended capability devices with as many as 80 transceivers supporting individual line rates up to 13.1Gbps and devices that provide up to 1.9Tbps serial bandwidth. Also, these devices offer up to 850 SelectIO pins enabling the industry’s greatest number of parallel banks of 72-bit DDR3 memory interfaces supporting 2133Mbps. Future devices will also feature 28Gbps transceivers.
  • Kintex-7 Family: Establishing a new category of FPGAs, the Kintex-7 family delivers Virtex-6 family performance at less than half the price for a 2x price/performance improvement while consuming 50 percent less power. The family includes high-performance 10.3Gbps or lower-cost optimized 6.5Gbps serial connectivity, memory, and logic performance required for applications such as high volume 10G optical wired communication equipment. It also provides a balance of signal processing performance, power consumption, and cost to support the deployment of Long Term Evolution (LTE) wireless networks, meet the aggressive power and cost requirements required for next generation high definition 3D flat panel displays, and deliver the performance and bandwidth needed for next generation broadcast video-on-demand systems.
  • Artix-7 Family: Delivering 50 percent lower power and 35 percent lower cost compared to the Spartan-6 family, the Artix-7 family utilizes small form-factor packaging and the unified Virtex-series based architecture to deliver the performance required to address cost-sensitive, high-volume markets previously served by ASSPs, ASICs, and low-cost FPGAs. This new family meets low power performance requirements of battery-powered portable ultrasound equipment, and addresses small form factor, low power requirements for commercial digital camera lens control, as well as the strict size, weight, power, and cost (SWAPc) requirements for military avionics and communications equipment.

Availability

Early access ISE Design Suite software supporting 7 series FPGAs is now available. Initial devices will be available in Q1 of CY2011. For more information, please visit: www.xilinx.com/7.

About Xilinx

Xilinx is the world’s leading provider of programmable platforms. For more information, visit: http://www.xilinx.com/.

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Agilent Technologies Supports Percello’s Femtocell SoCs Test with Chipset Software

SANTA CLARA, Calif., June 16, 2010 — Agilent Technologies Inc. (NYSE: A) announced its N7309A chipset software now supports high-volume manufacturing test for Percello’s Aquilo Femtocell System-on-a-Chip (SoC) product line. The chipset software delivers rapid calibration and verification testing for the time-to-market/volume requirements of original design manufacturers and contract manufacturers.

“We are very excited to have a complete test solution for our Aquilo Femtocell SoC product line,” said Rafy Carmon, vice president of Research and Development, Percello. “Our Aquilo Femtocell HSPA+ devices  deliver high-speed, low-power and rich functionality in a very efficient silicon design. Having a foundational test solution with Agilent’s chipset software really facilitates our ability to meet the growing industry demands.” 

“The N7309A chipset software was designed to support the entire Aquilo Femtocell SoC product line,” said Garrett Lees, applications marketing manager at Agilent’s Microwave and Communications Division. “With such a rich product line, femtocell vendors can develop residential, enterprise and outdoor solutions with minimum effort using our N7309A chipset software.”

Agilent N7300 software solutions are supported on the Agilent MXAEXA signal analyzers and MXGESG signal generators and give platform compatibility with Agilent X-series applications and test hardware. Agilent’s consistent X-Series platform utilization, from design, verification and manufacturing, protects the customer’s test investment. Additional information about N7300 chipset solutions can be found at www.agilent.com/find/n7300.

About Percello

Percello, a fabless semiconductor company, provides digital baseband solutions to address challenges of the 3G/HSDPA/HSUPA/HSPA+/LTE femtocell and picocell market: cost, power, level of integration, development time and flexibility. Percello has vast knowledge in silicon design, software and 3G/HSDPA/HSUPA/HSPA+/LTE communication systems. Percello’s architecture combines programmable multi-processing DSPs and dedicated hardware accelerators. This approach is optimized for power consumption, cost reduction and risk minimization. For more information about Percello, please visit www.percello.com.

About Agilent Technologies

Agilent Technologies Inc. (NYSE: A) is the world’s premier measurement company and a technology leader in chemical analysis, life sciences, electronics and communications. The company’s 19,000 employees serve customers in more than 110 countries. Agilent had net revenues of $4.5 billion in fiscal 2009. Information about Agilent is available on the Web at www.agilent.com.

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CISSOID Introduces STROMBOLI™

Mont-Saint-Guibert, Belgium – June, 2010 – CISSOID, the leader in high temperature semiconductor solutions, released their new STROMBOLI™  technology, a flexible and scalable reference design and demonstration boards for high temperature, high voltage isolated DC-DC converters which operate reliably and with high efficiency from -55°C to +225°C.

STROMBOLI™ can convert input voltages up to 400V into multiple, symmetrical if required, output voltages up to +/-25V. The galvanic isolation between input an outputs is at least 10 MW at 500V.

The STROMBOLI™ technology includes an Application Note, a Reference Design and a demonstration board with the related datasheet, schematics, and bill-of-material (BOM). The demonstration board is available in two versions, optimized for input voltage ranges of 15V-40V or 150-350V. They both provide a symmetrical output at +/-12V and can deliver 25W with efficiencies up to 70% at 225°C.

Besides these examples, STROMBOLI™ technology can be used to build isolated DC-DC converters delivering up to 150W output power. The input voltage range can be adapted to cover the 540V input voltage requirement of Industrial applications and the level of isolation can be brought as high as the 2.5KV required for some Aeronautics applications.

STROMBOLI™ design is based on the fly-back architecture making the technology highly flexible and scalable, easily adaptable by customers depending on their needs. For high output powers, a synchronous rectification is implemented for an improved efficiency while for low power levels, standard rectification can simplify the BOM. A magnetic feedback provides the output voltage temperature stability and the load regulation. STROMBOLI™ features CISSOID’s chip-set MAGMA & HYPERION and high temperature transistors from the PLANET family. STROMBOLI™also features an Under-Voltage-Lockout (UVLO) function and the pulse-by-pulse current sensing provides intrinsic output current limitation in case of overload or short-circuits.

With STROMBOLI™, CISSOID further extends its VOLCANO family of DC-DC converters that operate reliably under extreme temperature. While ETNA, VESUVIO and EREBUS target point-of-load applications, STROMBOLI provides galvanic isolation and symmetrical outputs, together with an extended range if input voltages.

STROMBOLI™ technology is available immediately for licensing. The reference design and its active BOM can be mapped onto high temperature substrates and assembled in high reliability modules. For more information, visit www.cissoid.com or contact the company’s representatives at www.cissoid.com/company/about-us/contacts.html

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