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CEVA partners with Infineon Technologies for Next-Generation Wireless Platforms

SAN JOSE, Calif. – June 07, 2010 – CEVA, Inc. [(NASDAQ: CEVA); (LSE: CVA)], the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and Infineon Technologies today announced the Companies have extended their long-term strategic relationship to include the dual MAC, 32-bit CEVA-TeakLite-III DSP core for the future mobile phone and modem platform solutions from Infineon.

This latest agreement enables Infineon to leverage the superior features and processing performance offered by the latest generation CEVA-TeakLite-III DSP architecture while maintaining code compatibility with the existing CEVA-based Infineon architectures. The CEVA-TeakLite-III delivers industry-leading DSP performance required for advanced modem, voice and audio processing while maintaining low power and small die size.

 “DSP plays an essential role in overall power consumption and performance in handsets and the CEVA-TeakLite-III DSP brings to Infineon the capability to dramatically improve future wireless and multimedia processor designs,” said Gideon Wertheizer, CEO of CEVA. “We look forward to continuing our long standing partnership with Infineon to advance their leadership in mobile phone and modem platforms.”

CEVA’s industry-leading DSP cores power many of the world’s leading handsets today, with all top five handset OEMs shipping CEVA-powered phones. To date, more than 700 million CEVA-powered handsets have shipped worldwide spanning the entire value chain, from ultra-low cost devices through to smartphones. Addressing next-generation 4G terminal and infrastructure markets, CEVA’s latest generation DSPs have been specifically architected to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high-performance multimode 2G/3G/4G solutions.

About CEVA

CEVA is the leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA’s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2009, CEVA’s IP was shipped in over 330 million devices, including handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every four handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com

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Xilinx Virtex-6 and Spartan-6 FPGA Connectivity Targeted Reference Designs Support PCI Express-Compliant Designs

SAN JOSE, Calif., June 7 — Xilinx Inc. (NASDAQ:XLNX) today announced that its Spartan®-6 and Virtex®-6 FPGA Connectivity Targeted Reference Designs are PCI Express® compliant, offering developers a comprehensive, real-world example to reference for their next high-speed Serial I/O design. As part of Xilinx’s Connectivity Targeted Design Platform, the reference designs help enable fast deployment of customer end-product systems by giving designers the resources they need to focus their design time on differentiation.

“Xilinx recognized early the importance of providing proven PCIe® solutions that allow customers to easily incorporate the capability without spending months of learning and evaluation,” said Xilinx Director of Platform Marketing Brent Przybus. “The Spartan-6 FPGA and Virtex-6 FPGA Connectivity Targeted Design Platforms are designed to provide out-of-the-box working PCIe connectivity solutions to enable designers to quickly connect and focus on the rest of the system. The validation through compliance of these Targeted Design Platforms in addition to compliance of blocks and transceiver technology with PCIe standards reinforce our commitment to the underlying technology and making it easily accessible to customers.”

In the May 25, 2010 PCI-SIG Compliance Workshop #71, Xilinx’s Spartan-6 FPGA Connectivity Targeted Reference Design passed the PCI-SIG compliance and interoperability testing for PCIe 1.1 single-lane configuration with on-chip GTP serial transceivers running at 2.5 Gbps. The Virtex-6 FPGA Connectivity Targeted Reference Design passed PCI-SIG compliance and interoperability testing for PCIe 2.0 x4-lane Gen2 configuration with the GTX Serial transceivers running at 5 Gbps.

Both Targeted Reference Designs provide designers with a sophisticated, high-performance platform for advanced Serial I/O design for use in applications such as wired communications systems, wireless infrastructure, audio, video, broadcast, industrial, automotive infotainment, aerospace, defense and high-end consumer devices.

Continued Momentum of PCI Express via Connectivity Targeted Design Platforms

Xilinx has demonstrated continued leadership in the FPGA industry in support of PCI Express solutions for more than eight years. Xilinx was the first to integrate compliant PCIe version 1.1 blocks into programmable devices with its Virtex-5 family and has continued its momentum of PCIe support by achieving PCI-SIG compliance with Virtex-6 and Spartan-6 FPGA devices. Since that time, Xilinx has been able to offer developers the highest performance PCI Express interface through its FPGAs, while also delivering the lowest power integrated PCIe block in a device.

Xilinx’s Connectivity Targeted Design Platforms enable the fastest deployment of customer end-product systems across the serial spectrum – mainstream through ultra-high end – and provide valuable benefits for architecting high-speed Serial I/O applications. Xilinx is committed to providing connectivity development tools, methodologies, IP and support through its Targeted Design Platforms. The Targeted Design Platform for connectivity brings these elements together into productized solutions that accelerate development for experienced users and simplifies the adoption of FPGAs for new users.

Targeted Reference Designs Available Today

The PCIe DMA-Gigabit Ethernet targeted reference design is integrated and included with the Xilinx Spartan-6 FPGA Connectivity Kit for $1,995. The PCIe 10G DMA-XAUI targeted reference design is integrated and included with the Xilinx Virtex-6 FPGA Connectivity Kit for $2,495. For more information on the Virtex-6 FPGA Connectivity Kit Targeted Reference Design, visit the website at:http://www.xilinx.com/V6ConnKit, and for the Spartan-6 FPGA Connectivity Kit, visit the website at:http://www.xilinx.com/S6ConnKit.

About Xilinx

Xilinx is the worldwide leader in complete programmable logic solutions. For more information, visit http://www.xilinx.com/.

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