NEW YORK –– May 25, 2010 –– Steve Teig, president and chief technology officer (CTO) of Tabula, will describe an approach to move beyond von Neumann computing during a luncheon hosted by the IEEE Council on Electronic Design Automation (CEDA) at the 47th Design Automation Conference (DAC). 

The lunch, open to all DAC attendees on a first-come, first-served basis, will be held Tuesday, June 15, from noon-2 p.m. in Room #303 at the Anaheim Convention Center in Anaheim, Calif. 

In his talk, Teig, inventor of Tabula’s Spacetime 3-Dimensional Programmable Logic Architecture, will describe a simultaneous approach to design of architecture, hardware and software.  He will explain how he sees them as aspects of a cohesive whole, similar to the way John von Neumann, inventor of the von Neumann architecture, and Alan Turing, developer of the Turing machine, did.  Teig will illustrate why he believes that a new approach to architectural design will maximize the opportunities to go beyond von Neumann computing.

Prior to co-founding Tabula, a fabless semiconductor company that has developed a new category of 3-D Programmable Logic Devices (3PLDs), Teig was co-CTO of Cadence Design Systems, joining Cadence through its acquisition of Simplex Solutions, where he was CTO.  He co-founded two successful biotechnology companies –– CombiChem and BioCAD –– as well as an EDA company, Tangent Systems.  Teig holds more than 220 patents.

Birds of a Feather Session

CEDA will host a Birds of a Feather session during DAC on social media moderated by Shishpal Rawat, CEDA’s vice president of technical activities and director of Business Enabling Programs and EDA Investments for Intel Corp.  It will be held Tuesday, June 15, from 6:30-8 p.m. in Room 209 in the Anaheim Convention Center.  The discussion will focus on trends in social media and on ways to better utilize social media channels to reach a wider EDA audience.  Rawat will attempt to determine which mechanisms are used by the EDA community and how to reach them.

For more details, visit the CEDA website located at: www.c-eda.org.

About the IEEE Council on EDA

The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across six IEEE societies (Antennas and Propagation; Circuits and Systems; Computer; Electron Devices; Microwave Theory and Techniques; and Solid State Circuits).  It sponsors more than 12 conferences, including the Design Automation Conference (DAC), International Conference in CAD (ICCAD) and Design Automation and Test in Europe (DATE).  CEDA publishes IEEE Transactions on CAD and the IEEE Embedded Systems Letters.  CEDA is increasingly involved in recognizing its leaders via the A. Richard Newton Award, Early Career Award and Phil Kaufmann Award.  CEDA welcomes volunteers and local chapters.  For more details, visit: www.c-eda.org.

San Diego, California, May 25, 2010   * * *   Three new modules from congatec have been added to the congatec-AG COM Express family and, as with previous models, offer the full scalability of a new CPU platform. They are 100% image compatible and have a common software driver, which facilitates integration into various systems. In all, there are a total of thirteen module variants now available for conga-CS45, conga-BS45 and conga-BM45.

“With these three new modules congatec is continuing to provide the great interchangeability and scalability that we have gained a reputation for,” stated Ron Mazza, general manager of congatec US. “In addition, with these new products congatec now offers the widest range of Intel-based COM Express solutions in the industry and is in a great position for growth as consumer electronic products become smaller and more mobile.”

New Product Specifications

The smallest version in this product family is the conga-CS45 COM Express Compact module with an Intel® Celeron® M 723 processor and  an Intel® GS45 chipset. With 1.2 GHz and a 1 MB L2 cache, this ultra low voltage processor model provides sufficient performance for a range of applications. It supports up to 4 GB DDR3 SO-DIMM memory. Due to its compact 95×95 mm size, the conga-CS45 is predestined for mobile applications such as ruggedized handhelds. In the laboratory with SiSoft Sandra in Dhrystone ALU mode it achieves 7342 MIPS with a power consumption of 10 watts.

A higher performance model that still only requires low power, is the conga-BS45 module (95 x 125 mm) with an Intel® CoreT 2 Duo SU9300 processor, 1.2 GHz, 3MB L2 cache and the Intel® GS45 chipset with support for up to 8 GB DDR3 Dual Channel memory. In a direct comparison with the conga-CS45 in the laboratory, it achieved 9740 MIPS with a TDP of 10 watts. The corresponding dual core application could, for example, be an automation control station with real-time visualization in which hyper threading technology enables each core to run its own independent operating system.

The high-end module is the conga-BM45 (95 x 125 mm) with the Intel® CoreT 2 Duo T9400 processor, 2.53GHz, 6MB L2 cache and the Intel® GM45 chipset. The computer-on-module (COM) provides the required processor and graphics performance for performance-hungry gaming systems, for example, and can be equipped with up to 8 GB DDR3 Dual Channel memory. In the laboratory it achieved an impressive 23,366 MIPS with a TDP of 35 watts.
All COM Express modules in the “45” series offer great performance and considerable graphics flexibility. The two independent graphics pipelines can be used for 2×24 bit LVDS, SDVO, TV-Out, analogue VGA as well as new interfaces such as DisplayPort and HDMI.

Pricing and Availability

All COM Express modules are now available in series production volumes. Sample pricing ranges between $500 – $1,000US.

About congatec AG

congatec AG has its head office in Deggendorf, Germany. It is an innovative business that specializes in the development and marketing of industrial computer modules using the standard form factors Qseven, COM Express, XTX and ETX. With this focus and annual revenue of 26 million euros (2009), congatec is today a leading manufacturer in this field. The company’s products can be used in a variety of industries and applications, such as industrial automation, medical technology, automotive supplies, aerospace and transportation. Core knowledge and technical know-how includes unique extended BIOS features as well as comprehensive driver and board support packages. Following the design-in phase, customers are given support via extensive product lifecycle management. The company’s products are manufactured by specialist service providers in accordance with modern quality standards. congatec currently has 80 employees and has branch offices in Plzen and Brno/Czech Republic, Taipei/Taiwan and San Diego/USA. More information is available on our website at www.congatec.us

COLORADO SPRINGS, CO — May 25, 2010 — Ramtron International Corporation (Nasdaq: RMTR), the leading developer and supplier of ferroelectric-based low power memory and integrated semiconductor products, today announced that its FM25V10-G – a 1-Megabit (Mb), 2.0-3.6V serial F-RAM memory device – has been qualified to AEC-Q100 Grade 3 standards. This rigorous automotive-grade qualification, established by the Automotive Electronic Council’s Stress Test Qualification for Integrated Circuits, expands Ramtron’s portfolio of AEC-Q100 compliant memory to 15 devices, which are designed to meet the demanding requirements of the automotive market. The Grade-3 qualification ensures device operation over the automotive temperature range of -40 to +85 degrees Celsius.

The FM25V10-G is a member of Ramtron’s V-Family nonvolatile F-RAM memory, which features a wide operating voltage range of 2.0 to 3.6-volts. The FM25V10-G is a 1-Mb serial SPI device that has an operating current of 3.0 mA (Idd at 40MHz) in an industry standard 8-pin SOIC package. The product operates at full bus speed of 40MHz, features NoDelay™ writes, virtually unlimited read/write cycles, and low power consumption. The device is a drop-in replacement for 1-Mb serial Flash and serial EEPROM memories in automotive, industrial controls, metering, medical, military, gaming, and computing applications, among others.

“The FM25V10 demonstrates automotive-grade compliance of our highest density product to date,” comments Ramtron marketing manager, Mike Peters. “Adding Grade 3 qualification to our V-Family product line allows us to offer power-efficient, high-performance nonvolatile memories to automotive customers over the entire density range of 4-kilobits to 1-megabit.”

About the F-RAM V-Family

Ramtron’s V-Family of F-RAM products includes a variety of serial I2C, serial SPI, and parallel memories. The V-Family enables improved device specifications and increased feature sets. The serial V-Family products offer an optional unique 64-bit serial number, comprised of a 16-bit unique customer ID, a 40-bit manufacturing serial number, and an 8-bit cyclic redundancy check for systems that require unique electronic numbering for added security.

Samples of the FM25V10-G are available now in a RoHS-compliant, 8-pin SOIC package.  Unit pricing begins at $5.05 for the FM25V10-G and $5.19 for the optional unique serial number device (FM25VN10-G) in quantities of 10K.

About Ramtron

Ramtron International Corporation, headquartered in Colorado Springs, Colorado, is a fabless semiconductor company that designs, develops and markets specialized semiconductor memory and integrated semiconductor solutions used in a wide range of product applications and markets worldwide. For more information, visit www.ramtron.com.

For a 300-dpi product photo, visit www.ramtron.com/press-center/image-bank.aspx (see F-RAM V-Family).