SAN JOSE, Calif., May 12, 2010 – Xilinx K.K., the Japanese subsidiary of the world’s leading supplier of programmable platforms, Xilinx, Inc. (NASDAQ: XLNX), and Hitachi Information & Communication Engineering, Ltd., today announced a new LogicBench® series. LogicBench is proven system-level design verification platform. The new series uses Xilinx® Virtex®-6 LX760, the fastest and highest performance FPGA, and other Virtex-6 FPGA sub-families. Hitachi Information & Communication Engineering also launched sales for the Japanese domestic market today.

Hitachi Information & Communication Engineering will exhibit and give demonstrations of the new LogicBench series and its VirtualTurbo®-III hardware-software co-development platform at the 13th Embedded Systems Expo and Conference (ESEC) from May 12 through 14 at Tokyo Big Sight (Booth No. East Hall 38-7).

LogicBench series are verification platforms for algorithm design, large-scale integration (LSI) feature testing, hardware-software integration testing, FPGA prototyping system verification, and all other system design processes. By combining system-level modeling technology, it enables architecture exploration for LSI development and advanced software development from an early stage and provides an ideal prototyping environment for developing image-processing, network, and other devices requiring complex algorithms. Since its first release in 1998, over 500 LogicBench modules for about 60 sites have been sold, making it one of the most popular platforms in Japan’s prototyping market. Virtex-6 is the sixth generation of Xilinx’s flagship Virtex FPGAs designed into the LogicBench series.

“Growing ASIC development risks in the prototyping market are prompting increased use of FPGAs for prototyping and, likewise, mass production,” said Masahiro Yamada, general manager of the DesignBench System Solution Department, Embedded Technology Division, Hitachi Information & Communication Engineering. “The latest LogicBench series incorporating Virtex-6 FPGA provides 2.4X the logic density of the previous generation, facilitating the building of large-scale prototyping environments that are in demand now. Since the greater scale and speed it offers should result in wider usage for algorithm verification at upstream design stages and other applications, we anticipate that the new LogicBench series will generate about \1.2 billion’s worth of business annually.”

“Hitachi Information & Communication Engineering has adopted our FPGAs in five generations of LogicBench,” said Sam Rogan, president of Xilinx K.K. “Its development teams know a great deal about development environments, and their ability to provide solid solutions is rated very highly in the prototyping market. We’ll continue to align with Hitachi Information & Communication Engineering to enable further reductions in large-scale LSI development time and provide other benefits to the industry.”

The Virtex-6 LX760 device is a key component of the new LogicBench series, offering unrivaled performance and speed, and ideally suited for any application requiring intensive computational performance and high logic density. For example, the new large-capacity device enables designers to use FPGAs to prototype or emulate a greater range of LSI designs. Virtex-6 LX760 device offers a higher I/O count than competing FPGAs to simplify partitioning of large LSI logic across multiple FPGAs. In addition, Virtex-6 LX760 device provides flexible SelectIO^TM technology and 25,920 kbit Block RAM to meet system-leveled verification as well as advanced verification of applications.

Main features of the new LogicBench series:

Model: LogicBench Virtex-6 4 FPGA module   

FPGAs: Virtex-6 LX760 FPGA x 4

Implementable Logic density:  Scale of 24M ASIC gates  (2.4x current products)

Board: 

• 40-layer high-density printed circuit board (120mm X 140mm) with direct wiring with inter-signal loss cue, SI-optimized design
• 500MHz signal connection speed between FPGAs (2.5x faster than the previous generation)

Memory: —

Interfaces: High-speed LVDS

Applications: Ideal for mobile device base-band processing, development prototyping of multi-processor and other ultra-large-scale ASIC applications

——–

Model: LogicBench Virtex-6  2 FPGA module

FPGAs: Virtex-6 LX760 FPGA x 1, Virtex-6 LX550T FPGA x 1

Implementable Logic density: Scale of 10M ASIC gates

Board:

• 40-layer high-density printed circuit board (120mm X 140mm) with direct wiring with inter-signal loss cue, SI-optimized design
• 500MHz signal connection speed between FPGAs (2.5x faster than the previous generation)

Memory: Large-capacity DDR3-SDRAM

Interfaces: Industry daughter card standard FMC (FPGA mezzanine card)

Applications: Ideal for verification of communications, image processing, and other memory-intensive processes running in realtime

——-

Model: VirtualTurbo-III PCI Express® board

FPGAs: Virtex-6 LX240T FPGA x1

Implementable Logic density: Sale of 5M ASIC gates

Board: 

• Support for up to eight PCI Express® Gen2 lanes
• To be used as LogicBench base board

Memory: Large-capacity DDR3-SDRAM

Interfaces: 

• Industry daughter card standard FMC (FPGA mezzanine card)
• PC interoperation option available (see note)

Applications: 

• Hardware–software co-development
• Accelerating algorithm design and logical simulations

Note: Transactor API available for C/C++ program, logical simulation, (TLM2.0 interface-compliant) SystemC simulation, and virtual prototyping environments

Visit Hitachi Information & Communication Engineering’s website for additional LogicBench series details, including pricing and availability for shipment within the Japanese domestic market: http://www.hitachi-jten.co.jp/products/logicbench/.

About Hitachi Information & Communication Engineering

Hitachi Information & Communication Engineering, Ltd. provides one-stop services from the evaluation of specifications through to the design, verification trial, and manufacture of boards and systems, LSIs, and FPGAs. The company supplies embedded system development and verification solutions to customers in a broad range of fields by leveraging the synergies derived from the abundant experience of its in-house design and verification engineers and its field-proven LogicBench system-level development and verification platform, which obviates the need to reproduce ultra-high density LSIs of the several-million- to 10-million-gate class. For more information, visit Hitachi Information & Communication Engineering’s website at http://www.hitachi-jten.co.jp/.

About Xilinx

Xilinx is the world’s leading provider of programmable platforms. For more information, visit www.xilinx.com.

St. Louis, Missouri, USA – May 11, 2010 – Laird Technologies, Inc., a global leader in the design and supply of customized, performance-critical components and systems for advanced electronics and wireless products, today announced that one of its subject matter experts, Vice President of Technology for the Laird Performance Materials Division, Dr. Richard Hill, will make a presentation at the PURE Lighting Technology Symposium hosted by Digi-Key.

Dr. Hill will participate in a panel discussion of industry experts focusing on lighting lifetimes and reliability. The theme for the panel discussion is “How real is a 50,000-hour lifetime for LEDs?” Dr. Hill will give a twenty minute presentation addressing the design considerations that go into the thermal management of LED lighting, with a brief Q&A session afterwards.

“This symposium presents a great opportunity for Laird Technologies to discuss the technical aspects of LED thermal issues and solutions,” said Hill. “It provides a great venue in which to address the public on proper thermal management solutions for LED applications.”

The PURE Lighting Technology Symposium will take place Thursday, May 13, 2010 at the PURE Nightclub, located at Caesar’s Palace in Las Vegas, Nevada. The symposium will feature displays, discussions, and innovations in the lighting industry from some of Digi-Key’s authorized lighting suppliers, including Laird Technologies. Participating suppliers will also conduct product demonstrations during the event.

As an industry leader in high-performance and cost-effective thermal management solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets.

Dr. Hill joined Laird Technologies in 1999 and has more than 35 years experience in technology and new business development including research and development in zeolites, aluminas, ceramic materials for electronic applications, thermally conductive polymer-ceramic composite technology, and technology transfer. His primary focus at Laird Technologies is on thermal interface materials (TIMs), thermally conductive printed circuit boards (PCBs), and thermoelectric materials for use in heat transfer applications, as well as guiding long range efforts in EMI shielding, absorbing, and signal integrity materials. Dr. Hill’s educational background includes a BS in Ceramic Engineering and an MS in Ceramic Science, both from Rutgers University. In 2002 he received his doctorate degree in Materials Science from the University of Leoben in Austria. Dr. Hill is inventor on 17 U.S. patents on sol-gel synthesis, boron nitride, and thermal transfer materials.

About Digi-Key Corporation

As one of the world’s fastest growing distributors of electronic components, Digi-Key Corporation has earned its reputation as an industry leader through its total commitment to service and performance. Digi-Key is a full-service provider of both prototype/design and production quantities of electronic components, offering more than 1.5 million products from over 440 quality name-brand manufacturers.

A testament to Digi-Key’s unparalleled commitment to service, North American design engineers have ranked Digi-Key #1 for Overall Performance for 18 consecutive years (EE Times Distribution Study/August 2009). Additional information and access to Digi-Key’s broad product offering is available at www.digikey.com.

About Laird Technologies, Inc.

Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.

The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, mechanical actuation systems, signal integrity components, and wireless antenna solutions, as well as radio frequency (RF) modules and systems. 

Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, and industrial markets.

Laird Technologies, a unit of Laird PLC, employs over 10,000 employees in more than 39 facilities located in 13 countries.