Moirans-Grenoble, France – March 8, 2009 – Docea Power, the Electronic System Level (ESL) company that delivers software for early power and thermal analysis, today announced that ST-Ericsson, a world leader in wireless platforms and semiconductors, has adopted and is deploying ACEplorer to improve architectural-level power choices for SoC (System-on-Chip) and platform design.

ST-Ericsson chose Docea Power’s ACEplorer for its ability to quickly create hierarchical power models, deliver precise architectural exploration and establish an effective methodology. ACEplorer models and optimizes power and thermal behavior of whole electronics systems. ACEplorer integrates a consistent power data management methodology for capturing and simulating power behavior. Its “separation of concerns”*(or divide and conquer) approach makes models usable across teams and design flows, from system level to silicon measurements.

ST-Ericsson saw high value in adopting ACEplorer for modeling complex platforms when compared to spreadsheets, especially for their new 3G multimedia platforms

“We are proud that ST-Ericsson adopted ACEplorer tool to tackle power and thermal options for its complex design projects,” said Ghislain Kaiser, co-founder and CEO of Docea Power. “It demonstrates the maturity of our solution for managing efficiently power and thermal issues in demanding sectors like the mobile industry.”

Docea Power is exhibiting at booth #52 at the Design, Automation & Test in Europe conference in Dresden, Germany,March 8 to 12 2010.

Benefits of ACEplorer

Shared, complex power and thermal design options in a consistent flow

ACEplorer allows several design teams to work in parallel and succeed in formalizing a structured power aspect for every architect and designer. ACEplorer’s communications capabilities –such as reports and diagrams – allow design teams to communicate key results to project leaders and managers.

Review of improvements early in the design cycle

In less than a few minutes, ACEplorer can deliver precise simulation results for many scenarios and variants so that system designers and architects can choose with more confidence the best options for Intellectual Property (IP), hardware/software partitioning, cost and power consumption.

More realistic scenarios when compared spreadsheet percentages

ACEplorer goes beyond the aspect of pure power, since it can take into account information about bandwidth, frequency, CPU load and temperature which is becoming critical issue so design teams can easily find the best trade-off to optimize SoC power and architecture.

Productivity with more details

Reviewing options with ACEplorer early in the design cycle can save man-month downstream, and gives the design team more detailed information for making better decisions.

About ST-Ericsson

ST-Ericsson is a world leader in developing and delivering a complete portfolio of innovative mobile platforms and cutting-edge wireless semiconductor solutions across the broad spectrum of mobile technologies. The company is a leading supplier to the top handset manufacturers and ST-Ericsson’s products and technologies enable more than half of all phones in use today. The company generated pro-forma sales of about USD 3.6billion in 2008. ST-Ericsson was established as a 50/50 joint venture by STMicroelectronics (NYSE:STM) and Ericsson (NASDAQ:ERIC) in February 2009, with headquarters in Geneva, Switzerland.

More information about ST-Ericsson is available at www.stericsson.com.

About Docea Power

Docea Power develops and commercializes a new generation of methodologies and solutions for enabling faster and more reliable power and thermal modeling at system level. Docea Power’s ACEplorer platform offers a consistent approach for executing architecture exploration and optimizing power and thermal behavior of electronic systems at an early stage of the project.

For more information: www.doceapower.com

BURLINGTON (Ontario) – March 18, 2010 – Gennum Corporation (TSX:GND) announced its presence at the Optical Fiber Communication Conference & Exhibition (OFC), to be held at the San Diego Convention Center from March 23 – 25, 2010.  Gennum will be demonstrating its newest products for the optical networking market live at booth # 203.

Gennum’s growing portfolio of optical solutions addresses the increasing demands of the optical networking market, including highly integrated products to address power, performance and space constraints.  Gennum’s broad product portfolio now addresses both the 10 Gig SFP+ market, with its analog signal integrity solutions, as well as the 10 Gig EPON, Ethernet and Fiber Channel markets with its new highly integrated digital solutions.  Gennum plans to launch a new product family in conjunction with the event and will be demonstrating the working silicon of these new digital parts, live for the first time.  Gennum’s new product family will offer telecom and datacom customers the highest level of integration, functionality, and performance available in the market today.

Gennum will be demonstrating the performance results of several recently announced products, including the GN7350 , the world’s first single-chip 10G EPON transceiver, live at the show.  The GN7350 offers next generation PON (passive optical network) system manufacturers a solution that reduces power and cost in next generation designs, while enhancing ONU (optical network unit) performance.  Combining functionality from Gennum’s industry-leading CDR (clock and data recovery) and laser driver technologies the GN7350 enables PON system manufactures to quickly build prototype systems for in-house and field testing.

“We are very excited to announce Gennum’s newest optical IC products.  These products will enable network OEMs to improve their overall design while leveraging faster time-to-market, lower overall cost, and performance enhancements as a result of Gennum’s truly innovative approach to integrated solutions,” said Dr. Franz Fink, President and Chief Executive Officer, Gennum Corporation.

Visit Gennum at booth # 203 in the Corporate Village at the Optical Fiber Communication Conference & Exhibition.  Demonstrations are accessible by appointment only and can be arranged by contactingsales@gennum.com.

About Gennum Corporation

Gennum Corporation (TSX: GND) designs innovative semiconductor solutions and intellectual property (IP) cores for the world’s most advanced consumer connectivity, enterprise, video broadcast and data communications products. Leveraging the company’s proven optical, analog and mixed-signal products and IP, Gennum enables multimedia and data communications products to send and receive information without compromising the signal integrity. Recognized as an award winner for advances in high definition (HD) broadcasting, Gennum is headquartered in Burlington, Canada, and has global design, research and development and sales offices in Canada, Mexico, Japan, Germany, United States, Taiwan, India and the United Kingdom. www.gennum.com.