Enabling Ethernet-Over-NG-SONET/SDH Solutions for MSPP Linecards

by Kevin Morris

The combination of Altera’s Arria II GX family and TPACK’s 2.5-Gbps/10-Gbps Ethernet-over-SONET/SDH and 10-Gbps/20-Gbps switch/NPU solutions meet the requirements of next-generation MSPP linecards and maintain existing infrastructure. Like ASSPs, FPGAs are based on the traditional manufacturing process, either in-house or via commercial foundries, but due to their broader and more generic application, the production volume that FPGAs attain justifies investment in the latest manufacturing processes and technology.

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

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Connecting the World Through Space

Sponsored by Mouser Electronics and Qorvo

In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity.

Click here for more information about Qorvo SATCOM 13.75GHz to 14.5GHz GaN Power Amplifiers

Mar 30, 2026

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Enabling Ethernet-Over-NG-SONET/SDH Solutions for MSPP Linecards

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