feature article
Subscribe Now

STMicroelectronics Introduces SPEAr® Microprocessors for Embedded-Control Applications

GENEVA, Feb. 25 /PRNewswire-FirstCall/ — STMicroelectronics (NYSE:STM) , a world leader in system-on-chip technology, today unveiled four new members in the SPEAr microprocessor family, targeting embedded-control applications across market segments from computer peripherals and communication to industrial automation. Based on the latest ARM® core technology, ST’s SPEAr microprocessors enable equipment manufacturers to develop complex yet flexible digital engines at a fraction of the time and cost of competing solutions.

Manufactured in state-of-the-art low-power 90nm and 65nm HCMOS (high-speed CMOS) process technologies, ST’s SPEAr (Structured Processor Enhanced Architecture) embedded microprocessors provide high levels of computing power and connectivity. The devices combine one or two advanced ARM9 processor cores (ARM926EJ-S up to 400MHz in typical conditions, or 333MHz in worst-case conditions of temperature and voltage) with memory interfaces, and a large set of IP blocks delivering connectivity, communication, and audio/video functions for different applications.

The SPEAr microprocessors target networked devices used for communication, display and control in applications including VoIP phones, wireless access devices, printers, thin-client computers, PC docking stations, bar-code scanners/readers, home appliances, residential control and security systems, and medical lab/diagnostics equipment.
The SPEAr family members are:

The SPEAr300 is an excellent choice for human-machine interface and security applications. It contains:

  • Camera Interface
  • LCD and Keyboard Controller
  • Crypto Accelerator
  • TDM Bus
  • USB 2.0
  • Fast Ethernet

The SPEAr310 is tailored for telecom network applications. Integrated IP blocks include:

  • 5 fast Ethernet ports
  • TDM Bus
  • 2 HDLC ports
  • Crypto Accelerator
  • USB 2.0

The SPEAr320 is suitable for factory automation and consumer applications. Its function blocks include:

  • 2 CAN interfaces
  • 4 Serial ports
  • Standard parallel port
  • LCD Controller
  • Crypto Accelerator
  • USB 2.0

The dual-core SPEAr600, with benchmarked performance of 733 DMIPS (Dhrystone million instructions per second), targets highly compute-intensive embedded applications across market segments. In addition to the two cores, it contains:

  • Giga Ethernet
  • USB 2.0
  • External local bus access for glueless FPGA connection
  • LCD Controller

Facilitating a full-system project approach, ST provides SPEAr development kits that contain a complete set of elements to develop and test the customer system with minimum time and resource requirements.

ST’s new SPEAr embedded microprocessors are in full production. The single-core models (SPEAr300/310/320) are priced below US$7 for mass production quantities, the dual-core SPEAr600 sells below US$9 for mass production quantities.

About STMicroelectronics

STMicroelectronics is a global leader serving customers across the spectrum of electronics applications with innovative semiconductor solutions. ST aims to be the undisputed leader in multimedia convergence and power applications leveraging its vast array of technologies, design expertise and combination of intellectual property portfolio, strategic partnerships and manufacturing strength. In 2009, the Company’s net revenues were $8.51 billion. Further information on ST can be found at www.st.com.

Leave a Reply

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Connecting the World Through Space
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
Mar 30, 2026
28,964 views