BARCELONA, SPAIN – February 15, 2010 – RF Micro Devices, Inc. (Nasdaq GS: RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today introduced PowerSmart™ power platforms, a new product category designed to reshape the future of multimode, multi-band cellular RF architectures. RFMD’s PowerSmart™ platforms feature a revolutionary new RF Configurable Power Core™, which leverages industry-leading functional efficiency and delivers state-of-the-art processing of all known cellular communications modulation schemes, including GSM/GPRS, EDGE, EDGE Evolution, CDMA, 3G (TD-SCDMA or WCDMA/HSPA+) and 4G (LTE or WiMAX). With PowerSmart^TM, RFMD is enabling a new generation of global smartphones and mobile nternet devices requiring three or more bands of 3G or 4G.

The RF Configurable Power Core at the heart of each PowerSmart platform incorporates all power amplification and RF power management functionality. RFMD’s PowerSmart platforms also include all necessary switching and signal conditioning functionality in a compact reference design, providing smartphone manufacturers a single scalable source for the entire cellular front end. PowerSmart is modulation scheme agnostic and can support four bands of GSM/GPRS or EDGE and up to five bands of TD-SCDMA, WCDMA/HSPA+, LTE, WiMAX or CDMA all within a product footprint that is 35% smaller than today’s highest volume quad-band solutions. In a real-world comparison, versus today’s highest volume triple-band 3G solution using power amplifier duplexer (PAD) modules, PowerSmart reduces board space requirements by greater than 40%.

Eric Creviston, president of RFMD’s Cellular Products Group (CPG), said, “RFMD’s PowerSmart™power platforms deliver smartphone manufacturers enhanced performance and improvements in value and solution size that are unmatched in the cellular RF industry. PowerSmart^TM platforms process all known cellular modulations at optimum performance, with superior energy efficiency and at the industry’s lowest total cost of ownership. We anticipate significant customer adoption this year as PowerSmart^TM enables global 3G/4G penta-band implementations with product footprints that are smaller than those of triple-band solutions. With pricing below competitive penta-band WCDMA solutions and a revolutionary architecture that enables both global platform manufacturing and real-time RF configurability of individual smartphone models, PowerSmart™ is indeed smart power for smartphones.”

PowerSmart™ power platforms provide customers and cellular platform providers industry-leading mode coverage (GSM/GPRS, EDGE, EDGE Evolution, CDMA, TD-SCDMA, WCDMA/HSPA+ and LTE/4G) and industry-leading band coverage (bands 1-6 and 8-10). RFMD’s PowerSmart^TM platforms also help to extend battery life and significantly reduce average thermal dissipation both critical performance metrics for smartphone manufacturers by maximizing efficiency across power levels, across data rates (voice-only to LTE) and during non-ideal load conditions, also known as “antenna mismatch.” Each PowerSmart^TM platform utilizes a standardized digital interface (SDI) and is optimized to mate with leading multi-band HSPA+/EDGE/GPRS RF transceivers.

RFMD offers the industry’s broadest and most innovative portfolio of radio frequency components, including cellular power amplifier modules, cellular transmit modules, cellular switch and filter modules, and front ends for Wi-Fi, WiMAX and GPS applications. In addition to emerging multimode, multi-band architectures, RFMD’s industry-leading 3G/4G product portfolio accommodates all major RF architectures, including mode-specific/band-specific and mode-specific/multi-band architectures. RFMD also supplies a broad portfolio of 2G/2.5G power amplifier-based and switch-based components optimized for 3G handsets, providing a comprehensive RF product portfolio covering the entire cellular front end.

About RFMD

RF Micro Devices, Inc. (Nasdaq:RFMD) is a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies. RFMD’s products enable worldwide mobility, provide enhanced connectivity and support advanced functionality in the cellular handset, wireless infrastructure, wireless local area network (WLAN), CATV/broadband and aerospace and defense markets. RFMD is recognized for its diverse portfolio of semiconductor technologies and RF systems expertise and is a preferred supplier to the world’s leading mobile device, customer premises and communications equipment providers.

Headquartered in Greensboro, N.C., RFMD is an ISO 9001- and ISO 14001-certified manufacturer with worldwide engineering, design, sales and service facilities. RFMD is traded on the NASDAQ Global Select Market under the symbol RFMD. For more information, please visit RFMD’s web site at www.rfmd.com.

Los Gatos, CA – February 18, 2010 – Silicon Frontline Technology, Inc. (SFT), an Electronic Design Automation (EDA) company in the post-layout verification market, announced today that new versions of its flagship post-layout verification products, F3D (Fast 3D) for fast 3D extraction and R3D (Resistive 3D) for 3D extraction and analysis of large resistive structures like power devices, are shipping now. F3D improves its performance by up to 10x when compared to the previous version. F3D and R3D also accommodate larger designs than the previous versions announced in May 2009.

According to Dermott Lynch, VP Marketing at Silicon Frontline, “To address our customers’ post-layout verification needs as their technology options change, we are focused on improving our software products’ performance and our products’ capacity to handle full-chip designs.”

F3D is chosen for providing nanometer and Analog Mixed Signal (A/MS) design accuracy and R3D for its ability to improve the reliability and efficiency of semiconductor power devices.

F3D and R3D incorporate patent-pending 3D technology to deliver a Guaranteed Accurate solution for full-chip, post-layout verification. They work in industry standard flows allowing simpler adoption and quicker closure, with guaranteed accuracy, of the post-layout verification loop.

What’s New: Capacity and Performance

The latest version of Silicon Frontline’s 3D Field Solver technology accomplishes full-chip extraction with Field Solver accuracy and improves its performance and capacity. Typical examples of F3D running with Guaranteed Accuracy are a 65nm SOC run in under 2 hours (in the previous version this took 10 hours); MOMCaps run in under 1 minute (in the previous version this took 3 minutes and can  take over 7 hours with most commercial Field Solvers).

A tiling feature allows design size for F3D and R3D to be unlimited. Designs can be automatically partitioned into blocks of up to 4-million transistors and each block can be run using one CPU or multiple CPUs can run a number of design blocks in parallel. In the previous version the block size was limited to a maximum of 1-million transistors.

These results are not possible with commercial tools available today.

Why Users Pick Silicon Frontline

Guaranteed Accurate Post-Layout Verification Technology

Silicon Frontline’s post-layout verification software guarantees accuracy and high performance by using rigorous 3D technology to extract parasitics. Users have the option to specify the level of accuracy desired, net by net, at the block level or with regular expressions. By guaranteeing accuracy, Silicon Frontline is ensuring the resulting parasitics are correct within the user-specified accuracy.

Support for Standard and Advanced Nanometer Processes

The Silicon Frontline software has been qualified by major foundries for accuracy, performance, and capacity as well as integration with major physical verification systems. They are used for designs that target mature process technologies or advanced process technologies such as low as 28nm.

Accurate Advanced Field-Solver Technology, Better

For a 40nm design F3D delivered results within 2% of silicon, competing tools were up to 30% off.

Technology, Users, Target Applications

The technology in Silicon Frontline’s products is a combination of a rigorous 3D extraction method with a highly efficient 3D geometric engine yielding significant performance improvement and handling additional issues such as thickness variation due to CMP, width variation due to optical and other manufacturing effects. The software generates a fully annotated SPICE netlist with parasitics for use by downstream tools. It is used by CAD, TCAD and post-layout verification engineers.

F3D is ideally suited for sensitive analog and AMS circuits where coupling is a challenge – ADCs, DACs, circuits with differential signals, MIM/MOMCaps and 3D devices, image sensors, RF and high speed designs and for circuits manufactured at advanced technology nodes, such as 65, 40 and 32nm. R3D target applications include discrete or embedded power devices, where efficiency and reliability are important, as well as designs requiring analysis of large metal interconnects.

Price & Availability

The newest version of F3D and R3D are available now. For information on pricing, please contact info@siliconfrontline.com.

Silicon Frontline Milestones

Silicon Frontline introduced the company and its first products, F3D (Fast 3D) for fast 3D extraction and R3D (Resistive 3D) for 3D extraction and analysis of large resistive structures in May 2009.

In July 2009, UMC and TSMC validated the F3D product for nanometer design technologies. At the 2009 Design Automation Conference (DAC), the company was honored with a listing in GarySmithEDA’s What To See @ DAC 2009 list and inSCDsource’s ten hot technologies to see at DAC 2009. To date, Silicon Frontline customers are among the top 20 semiconductor companies.

About Silicon Frontline

Silicon Frontline Technology, Inc. provides post-layout verification software that is Guaranteed Accurate and works with existing design flows from major EDA vendors. Using new 3D technology, the company’s software products improve silicon quality for standard and advanced nanometer processes. For more information please visit www.siliconfrontline.com.

For sales or general assistance, please email info@SiliconFrontline.com or sft@marubeni-sys.com.