Adaptive Digital Technologies (Adaptive Digital) is announcing the availability of integration-ready solutions for high-end voice applications leveraging Texas Instruments’ (TI) new power-efficient TMS320C6472™ six-core digital signal processor (DSP) enabling developers to implement high-density, multi-channel, voice-over-packet applications in the shortest possible time with maximum processing performance. By incorporating Adaptive Digital’s proven solutions with TI’s new C6472 multi-core device, product developers can minimize solution development time while maximizing the power efficiency of their VoIP applications.

The C6472 high-performance multi-core DSP is targeted at process-intensive applications requiring low-power consumption, such as high-end industrial VoIP gateways, wireless media gateways, and remote access servers. Designed with these memory intensive telephony infrastructure applications in mind, TI’s C6472 expansive on-chip available memory eliminates the need for external memory, therefore reducing system power dissipation and improving the cost effectiveness of the equipment.

Adaptive Digital’s DSP software solutions address the need for high-density VoIP, and traditional telecommunications applications. The implementation-ready application solutions include high-density VoIP, AT&T-certified G.168 echo cancellation, conferencing, and transcoding. The solutions are turn-key, but also include host API software to simplify the process of integrating a host processor with the DSP application. The result is fast time to market. By porting G.PAK™ Voice-over-packet DSP software solution framework, and its application specific software and chips, Adaptive Digital is enabling developers to immediately take advantage of the TI’s newest multi-core device.  For more information about TI’s C6472, please visit: www.ti.com/c6472-pr-3p2

The combination of TI’s C6472 multi-core DSP and Adaptive Digital’s field-tested algorithms and G.PAK framework, provide a solid foundation for the development of high-quality, differentiated telecom products. Manufacturers of sophisticated telecom applications can now achieve maximum product capability in conjunction with the best power efficiency. For more information on Adaptive Digital’s solutions, please visit:

 http://www.adaptivedigital.com/product/solution/chip_sol.htm

About Adaptive Digital’s G.PAK™ Framework

Since its conception in 2002, G.PAK has been the keystone technology behind the many solutions that Adaptive Digital provides its customers. G.PAK is a scalable and configurable voice-over-packet DSP software solution that turns a digital signal processor chip into an easily controlled voice-over-packet engine. By including only the components, channel types, and peripherals required by a specific application, G.PAK generates a cost-effective, customer specific, downloadable DSP software image.  System designers can therefore leverage a proven solution, allowing them to focus their efforts on rapid product development. Additionally, DSP application source code is available, thereby empowering systems integrators to modify the application, adding any necessary customizations.

G.PAK always supports G.711 and can be configured at build time to optionally support G.726 (16, 24, 32, and 40 kbps), G.729AB, G.723.1, G.168 Plus™ packet, G.168, Automatic Gain Control (AGC), Voice Activity Detection (VAD), Comfort Noise Generation (CNG), Tone Relay (DTMF, MFR1, MFR2 Forward, and/or MFR2 Reverse), T.38 Fax Relay, and RTP/SRTP. G.168 can be configured to operate on PCM and/or packet data.

About Adaptive Digital Technologies

Adaptive Digital (www.adaptivedigital.com) continues to meet and exceed the current and future requirements of service providers, equipment manufacturers, system integrators and developers by bringing superior voice quality to speech-based applications.  Adaptive Digital’s highly optimized DSP Algorithms/Solutions include network, line, and acoustic echo cancellation, high-density conferencing, speech compression, telephony, and voice quality algorithms. Recognized internationally for its quality software, Adaptive Digital’s customers include British Telecom, Cisco Systems Inc., Cantata Technology, Digium®, General Dynamics, Motorola, Northrop Grumman, Sonus, and Texas Instruments.  Adaptive Digital is a member of the Texas Instruments’ Third Party Developer Network and is located in suburban Philadelphia, Pennsylvania (USA).

About the Texas Instruments Developer Network

Adaptive Digital is a member of the TI Developer Network, a community of respected, well-established companies offering products and services based on TI analog and digital technology. The Network provides a broad range of end-equipment solutions; embedded software, engineering services and development tools that help customers accelerate innovation to make the world smarter, healthier, safer, greener and more fun. www.ti.com/dspdevnetwork

Trademarks 

TMS320C64x+ and C64x+ are trademarks of Texas Instruments. All other trademarks and registered trademarks belong to their respective owners.

About Kane Computing

KCL (www.kanecomputing.co.uk) has been providing Image Processing, DSP and high performance computing products for use in industry, education and research since 1987 and is a Texas Instruments Third Party Partner specialising in consultancy and advice on TI development tools/platforms and image processing applications. KCL have extensive knowledge and experience of providing video compression solutions for many industries particularly for digital video security and high quality broadcast applications.KCL has a policy of continual improvement and operates its business in accordance with the requirements of ISO9001:2000.

Northwich, Cheshire, UK (February 2010). Kane Computing Ltd (KCL) today announced the launch of the new Lyrtech Perseus 601x Virtex 6 Advanced Mezzanine Card (AMC) with FPGA Mezzanine Card (FMC) support.

The Perseus 601X is designed for high performance, high-bandwidth and low-latency processing applications. Its FMC expansion site offers almost endless I/O possibilities. The card also takes full advantage of the Virtex-6 FPGA’s power, which, when combined with Lyrtech’s advanced software development tools, makes the Perseus 601X perfect to reduce size, complexity, risk and cost in leading-edge telecommunications, networking, industrial, defense and medical applications.

The ADAC250 FPGA mezzanine card (FMC) is the first of Lyrtech’s FMCs and designed around high-performance A/D and D/A conversion technology from Texas Instruments — it integrates one dual, 14-bit, 250 MSPS analog-to-digital converter (ADS62P59) and a dual, 16-bit, 1 GSPS digital-to-analog converter (DAC5682Z; also capable of a 2–4× interpolation mode). Combined with multiple clocks and synchronization modes, the ADAC250 is at its best in DSP applications such as software-defined radio (SDR), advanced telecommunications (MIMO systems, cognitive radios, beamformers, LTE, WiMAX), signal intelligence (SIGINT), radar, sonar, and medical imaging applications.

The ADAC250 uses the VITA 57.1 standard, widely used in the digital signal processing industry, which makes it easier for developers to integrate FPGAs into their embedded system designs. The FMC is completely Plug & Play with Lyrtech’s µTCA Perseus AMCs, but the ADAC250 can as easily be used on any FMC carrier out there.

The Perseus 601X comes with a comprehensive set of integrated, multilayer software development tools that offer users a choice of environments – from a base-level hand-coded design environment to a high-level graphical model-based design environment.

Commonly referred to as the BSDK, the base level kit offers reconfigurable FPGA components and reference designs, along with the infrastructure to implement, simulate, synthesize, validate, and deploy complete applications on the card’s Virtex-6 FPGA. This development kit takes care of the tiresome burden of reinventing interface drivers for the FPGA, freeing you to focus on unique, value-added development. The kit includes a complete and fully tested set of Virtex-6 interfaces to all the Perseus 601X’s peripherals.

The optional Perseus 601X MBDK allows you to easily design high-performance digital signal processing systems within the card’s FPGA with the MATLAB/Simulink design environment and extensive DSP IP libraries from Xilinx. For even greater flexibility, System Generator for DSP supports MicroBlaze soft processor cores, which allows using high-level abstractions that can be automatically compiled into the FPGA without losing any performance over VHDL designs. Use it with ChipScope Pro to troubleshoot your applications. These features, combined with the capabilities of the Virtex-6 FPGA, make it simple for designers to harness the parallel processing power of an FPGA.

Lyrtech is proud to embrace the new decade with the µTCA/AMC form factor, which basically erases all the limitations of the cPCI form factor. Advantages such as direct User-PC to card communication (no need for a CPU board), ultra-high-bandwidth communication (8x PCIe/SRIO/GigE), ease of interface with third-party products (RAID recorder, fiber channel communication, disk storage, etc.) all come with the new µTCA standard. Also, Lyrtech also embraces the FMC module standard for its I/Os, which will make it possible to resell I/O modules to other FMC carriers, as well as integrate third-party I/O boards to the product line.

The Virtex-6 family of FPGAs is the high-performance silicon foundation for targeted design platforms. Consuming 50 % less power and costing 20 % less than the previous generation of FPGAs, the Virtex-6 family is built with the right mix of programmability, integrated blocks for digital signal processing, memory and connectivity support – including high-speed transceiver capabilities – to satisfy the insatiable demand for higher bandwidth and higher performance.

About Lyrtech

Lyrtech (www.lyrtech.com) develops and manufactures advanced digital signal processing solutions for companies worldwide, a vital technology to network and wireless communications, audio and video processing, as well as electronic systems in all fields of technology. Lyrtech offers a full range of DSP-FPGA development platforms, as well as design, prototyping, and manufacturing of electronic products through its Innovator division. From the company’s state-of-the-art 4,645-m² (50,000-ft²) facility, Lyrtech’s Innovator division offers prototyping services, new product introduction services, turnkey assembly, box build assembly, and other electronic manufacturing services, providing customers with a quality production run of highly complex products with a fast turnaround. Lyrtech works in partnership with industry leaders such as Texas Instruments, The MathWorks, and Xilinx. Lyrtech’s customers include many prestigious names of the consumer electronics, telecommunications, aerospace, and defense fields such as BAE Systems, Defence Research and Development Canada (DRDC), the European Aerospace Defence and Space Company (EADS), Fujitsu, Harris, ITT, Motorola, Neural Audio, NTT DoCoMo, and Samsung-Thales.

About Kane Computing

KCL (www.kanecomputing.co.uk) has been providing Image Processing, DSP and high performance computing products for use in industry, education and research since 1987 and is a Texas Instruments Third Party Partner specialising in consultancy and advice on TI development tools/platforms and image processing applications. KCL have extensive knowledge and experience of providing video compression solutions for many industries particularly for digital video security and high quality broadcast applications.KCL has a policy of continual improvement and operates its business in accordance with the requirements of ISO9001:2000.

About Xilinx

Xilinx (www.xilinx.com) programmable chips are the innovation platform of choice for today’s leading companies for the design of tens of thousands of products that improve the quality of our everyday lives. Due to their inherent flexibility, Xilinx award-winning programmable solutions – silicon, software, IP, evaluation kits and reference designs – are used by more than 20,000 customers to: Deliver innovative new products to market in a matter of weeks, Drastically reduce research and development costs, Change or upgrade end product features and functions “on the fly” to meet new market demands and adapt to changing industry standards.