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Innovation at DATE 2010 Exhibition

To characterise the exhibition of DATE 2010 with one word, it would be ‘innovation’. The exhibition floor will be full of vendors showcasing their new products, collaborative projects disclosing their work to the public and universities demonstrating their latest research results. Also DATE’s exhibition features new ideas such as ‘what the users need’ sessions and the European EDA Village.

More than 60 companies and projects will exhibit at DATE 2010, including companies exhibiting at DATE for the first time like Globalfoundries or ZMDI (see the list of exhibitors below, the list will be kept updated at:  www.date-conference.com). Tool vendors such as Synopsys, Mentor Graphics and Cadence will organise half-day tool seminars.

“We are very happy that Silicon Saxony, the industry association located in the Dresden with nearly 300 companies in microelectronics, and other related sectors, is so actively supporting DATE, “ says Juergen Haase, Managing Director of edacentrum GmbH and responsible for organizing the Exhibition Program at DATE. Adding further “On each day of the exhibition they will present in a ‘what the users need’ session their future demand in terms of design methodology and tools, thus inviting the EDA vendors to mutually develop future business.”

European vendors will join forces at the European EDA village. “With 25+ companies and a work force of over 450 highly skilled technical and management specialists, our European EDA SMEs group is very important source of innovation for the semiconductor industry,” Andreas Ripp, Managing Director MunEDA, and Michel Tabusse, CEO Satin IP, point out.

Collaborative R&D initiatives represent the centerpiece for the strong position of Europe in microelectronics R&D.  Sponsored by local and national ministries as well as the European Commission, industry-lead research-initiatives will exhibit their results in the European Projects area. As one example, at the edacentrum booth the results of the BMBF (German ministry of research and education)-funded research program ICT 2020 will be presented, coverings topics like design of electronic systems for the car, methods for yield optimization of latest semiconductor technologies and robustness of future nanoelectronic systems. Further examples are European network for access to latest research results (ACCESS booth) and chip design for management of energy in local grids including use of resources like wind energy (edacentrum and University Booth).

In the University Booth demonstrations of 52 EDA tools and hardware prototypes will be presented by universities from 15 different countries, showing the worldwide importance of DATE.

The program covers key topics like Hardware Accelleration and Rapid Prototyping, System Exploration and Modelling, SoC Platforms and SystemC in Applications, Robust Design Environments, System Analysis and Verification.

The entrance to the exhibition is free, for conference delegates as well as for exhibition visitors. This includes also the program of the Exhibition Theatre, presenting Hot Topic sessions on Embedded Software, Autosar and Automotive Software Design, as well as panel discussions with executive management from companies like BMW or Infineon on topics like fabless semiconductors and the vehicle sector.

Exhibitors at DATE 2010: (as of February 14, 2010)
Update available at

http://www.date-conference.com/main/2010/find-company

  • Access Project
  • AIT Austrian Institute of Technology
  • ANSYS / Ansoft
  • Apache Design Solutions (Tool Seminar)
  • Artisan (Tool Seminar)
  • ArtistDesign European Network of Excellence on Embedded Systems Design
  • ATEEDA Limited
  • AWR Corporation
  • Beneware
  • Cadence (Tool Seminar)
  • Chipright
  • City of Dresden, Department of Economic Affairs
  • CMP
  • COCONUT EU project 
  • Concept Engineering GmbH
  • Cool Silicon
  • CST – Computer Simulation Technology AG 
  • DOCEA Power
  • DOLPHIN INTEGRATION
  • EDA Tech Forum
  • edacentrum GmbH
  • edXact
  • EE Times Europe 
  • Elsevier
  • EUROPRACTICE
  • Forte Design Systems
  • FP7 DIAMOND: Diagnosis, Error Modelling and Correction for Reliable Systems Design
  • Fraunhofer IIS, Institutsteil EA
  • GLOBALFOUNDRIES
  • HiPEAC NoE
  • ICT-eMuCo
  • Mentor Graphics (Tool Seminar)
  • MERASA
  • MNEMEE FP7 project
  • MOSART FP7 Project EP7
  • MOSIS 12
  • MULTICUBE Project
  • MunEDA
  • Nangate
  • Nano-Tera.ch
  • nSys Design Systems
  • OneSpin Solutions GmbH
  • PGC
  • Presto Engineering, Inc. 
  • Real Intent Inc
  • SAME
  • Satin IP Technologies
  • SATURN EU Project
  • Silicon Saxony e.V.
  • SoCLib
  • SPRINGER
  • Synopsys (Tool Seminar)
  • Tanner EDA
  • Target Compiler Technologies
  • TU Dresden, Vodafone Chair Mobile Communications Systems
  • University Booth
  • WHIZCHIP DESIGN TECHNOLOGIES Pvt Ltd
  • Wirtschaftsförderung Sachsen GmbH
  • X-FAB Semiconductor Foundries AG
  • ZMDI The Analog Mixed Signal Company

DATE 2010 will take place at the ICC in Dresden, Germany from 8-12 March 2010. 

Dresden, is well-known for its Elbe Valley and its numerous monuments from the 16th to 20th centuries and is the home ofSilicon Saxony, Europe’s largest network in the semiconductor, electronics, and microsystems industry.

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embWiSe announces SDIOWorx support on Microsoft Windows CE Platform

Chennai, India – February 12, 2010 embWiSe Technologies , the only third party vendor to offer SDIO stacks on different embedded OS platforms, had announced support for its SDIOWorx package on Microsoft’s Windows CE OS. 

Riding on the decent success of its SDIOWorx package with SDIO-WiFi support on popular embedded OS platform, embWiSe had developed and ported its SDIOWorx package on Microsoft’s Windows CE 6.0 as well. embWiSe is also supporting SDIO-WiFi drivers for leading WLAN chipsets with SDIOWorx for WinCE. embWiSe plan to target multimedia applications like the fast growing PMP/ Video Surveillance Camera,Portable Navigation Devices market as well as industrial control and Medical Devices.  

“Our SDIOWorx stack has been high performing and offers the best throughput under all OS platforms and the Windows CE version is no different. We are achieving a throughput of 18Mbps with an SDIO-WiFi device under Windows CE 6.0 on OMAP3 platform in open-air test environment. We  understand that we are late in the market with this offering – however the high performance throughput and ease of integration should interest device designers in the connected device space” said G.Srinivasan Director of Business Development at embWiSe. 

“SDIOWorx for WinCE is future ready that can truly harness the potential of newer wireless technologies like 802.11n in throughput intensive applications – for example HD Video Streaming – in the Mobile and CE devices market. A set of APIs that would be compatible with Microsoft’s native SDIO drivers in WinCE OS will be provided as part of the package to ensure compatibility with existing devices and chipsets,as well “ said Alagu Sankar, Director-Technical at embWiSe. 

embWiSe currently supports SDIOWorx under WinCE 6.0 on Marvell’s PXA270 and TI’s OMAP3530 processor platforms with more processor support on the anvil.For more information on SDIOWorx under Windows CE , visit : http://www.embwise.com/SDIOWorx_WinCE.pdf  . 

embWiSe also undertakes development, porting and integration of  the SPI-WiFi and SDIO-WiFi package for any other specific Host Processor/OS Platforms/WLAN chipset through an NRE services model. 

For more information contact embWiSe at: info@embwise.com   

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