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SMART Modular Technologies Expands Lineup of DDR3 High Density, Small Modules for Networking, Telecom, Storage, and Industrial Applications

NEWARK, Calif., January 12, 2010-SMART Modular Technologies (WWH), Inc. (“SMART” or the “Company”) (NASDAQ: SMOD), a leading independent manufacturer of memory modules and solid-state storage products, including SSDs, has expanded its lineup of DDR3 small modules. The new products include unbuffered and registered error-correction code (ECC) mini-DIMMs in very-low-profile (VLP) and standard heights as well as unbuffered and registered ECC SO-DIMMs. Serving a wide variety of applications in the networking, telecom, storage, and industrial markets, SMART’s DDR3 ECC small modules are optimized for space savings, high density, lower power, and high performance.

Available in a broad range of configurations, SMART’s DDR3 small modules are form-factor comparable to its DDR2 product line, allowing OEMs to continue using familiar memory modules while advancing performance and power savings with DDR3 technology. The DDR3 small modules handle commercial (0° to 70°C) and industrial (-40° to 85°C) temperature ranges.

“For small form-factor designs to exploit the benefits of memory technologies initially developed for computer servers and PCs, module manufacturers must apply a significant amount of engineering expertise to optimize and qualify these modules for operation in a wide range of alternative CPUs/platforms,” said Mike Rubino, SMART’s Vice President of Engineering. “SMART’s design teams have done just that, and I am very pleased with our broad offering of tailored, small form-factor DDR3 modules that have already been qualified by a number of OEMs across a variety of application-specific processors.”

The use of vertically mounted VLP mini-DIMMs is also becoming more common in space-constrained designs. “There is an ongoing need for higher-density memory in networking, telecom, and storage blade applications, and DDR3 memory with a small footprint is uniquely qualified to enable these next-generation designs,” said Sam Caldwell from Semico Research Corp. “We expect products using DDR3 memory modules to begin launching in 2010, and the projected market for DDR3 technology in networking, telecom, and storage blade applications is expected to be $1.32 billion for 2010.”

About SMART

SMART is a leading independent designer, manufacturer and supplier of electronic subsystems to original equipment manufacturers, or OEMs. SMART offers more than 500 standard and custom products to OEMs engaged in the computer, industrial, networking, aerospace, defense and telecommunications markets. Taking innovations from the design stage through manufacturing and delivery, SMART has developed a comprehensive memory product line that includes DRAM, SRAM, and Flash memory in various form factors. SMART also offers high performance, high capacity SSDs for enterprise, defense, aerospace, industrial automation, medical, and transportation markets. SMART’s presence in the U.S., Europe, Asia, and Latin America enables it to provide its customers with proven expertise in international logistics, asset management, and supply-chain management worldwide. See www.smartm.com for more information.

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