editor's blog
Subscribe Now

EDPS (The Electronic Design Process Symposium) is Silicon Valley’s Hidden Gem, September 13-14, 2018

For twenty-five years, EDPS—the Electronic Design Process Symposium—has been probing the very limits of design. While it formerly took place in exotic locale of Sand City on Monterey Bay (an appropriate locale for a silicon-centric event, no?), this year it’s being held at the SEMI facility in Milpitas. The event has evolved; it’s focus expanded. In addition to the usual discussions of innovative and bleeding-edge design techniques, this year’s event includes sessions with expanded coverage of topics including:

Keynote speakers and their topics include:

  • The Deep Learning Revolution, Chris Rowen, CEO of BabbLabs
  • The IEEE Semiconductor and Heterogeneous Integration Roadmap, Andrew Kahng, Professor of CSE and ECE at UCSD
  • Building Startups to Successful Exit, Jim Hogan, Well-known Silicon Valley Venture Capitalist and Private Investor
  • Hardware-Based Security, Simon Johnson, Senior Principal Engineer at Intel

 

For more information about the EDPS 2018 event, click here.

For registration (discounted to $199 until August 31), click here. Hey, that’s a bargain price for a 2-day event in Silicon Valley.

 

 

Leave a Reply

featured blogs
Sep 18, 2021
Projects with a steampunk look-and-feel incorporate retro-futuristic technology and aesthetics inspired by 19th-century industrial steam-powered machinery....
Sep 17, 2021
Dear BoardSurfers, I want to unapologetically hijack the normal news and exciting feature information that you are accustomed to reading about in the world of PCB Design blogs to eagerly let you know... [[ Click on the title to access the full blog on the Cadence Community s...
Sep 15, 2021
Learn how chiplets form the basis of multi-die HPC processor architectures, fueling modern HPC applications and scaling performance & power beyond Moore's Law. The post What's Driving the Demand for Chiplets? appeared first on From Silicon To Software....
Aug 5, 2021
Megh Computing's Video Analytics Solution (VAS) portfolio implements a flexible and scalable video analytics pipeline consisting of the following elements: Video Ingestion Video Transformation Object Detection and Inference Video Analytics Visualization   Because Megh's ...

featured video

Accurate Full-System Thermal 3D Analysis

Sponsored by Cadence Design Systems

Designing electronics for the data center challenges designers to minimize and dissipate heat. Electrothermal co-simulation requires system components to be accurately modeled and analyzed. Learn about a true 3D solution that offers full system scalability with 3D analysis accuracy for the entire chip, package, board, and enclosure.

Click here for more information about Celsius Thermal Solver

featured paper

Designing an Accurate, Multifunction Lithium-Ion Battery-Testing Solution

Sponsored by Texas Instruments

This paper highlights the benefits of a discrete solution over an integrated solution in order to meet current and future battery testing challenges. It also includes an example of a highly flexible battery testing design.

Click to read more

featured chalk talk

RF Interconnect for Automotive Applications

Sponsored by Mouser Electronics and Amphenol RF

Modern and future automotive systems will put enormous demands on RF. We need reliable, high-bandwidth, low-latency, secure wireless connections between cars and infrastructure, from car to car, and within systems on each car. In this episode of Chalk Talk, Amelia Dalton chats with Owen Barthelmes and Kelly Freeman of Amphenol RF to talk about interconnects for these new, challenging automotive RF systems.

Click here for more information