editor's blog
Subscribe Now

Multicore Microcontrollers for IoT and audio

XMOS has, from its base in Bristol, England, been quietly building up its business of creating a new force in the embedded market. The company has been shipping the xCore multicore microcontrollers into a wide range of companies around the world, and has built a particularly strong position in audio. Last summer it was announced that the company had raised £26.2 million from Robert Bosch Venture Capital, Huawei Technologies, and Xilinx.

Now it is announcing a new generation of  xCORE – xCORE 200, and a product specifically for the high resolution audio market – xCORE-Audio

The xCORE -200 is targeted at the Internet of Things, with Gigabit Ethernet joining USB 2.0 and high performance general IO, improved performance (2000 MIPS in the launch device), and increased memory. A new development , upgraded tool suite and improved libraries. Code written for earlier xCORE products will run on the xCORE-200. Deterministic real-time operations make the family suitable for a wide range of data acquisition, networking, HMI and other applications.

The success that XMOS has in audio provided the impetus for two  families optimised for this field. The xCORE-Audio/ Hi-Res is for consumer audio and video, including stero high resolution headphone amplifiers and the xCORE-Audio/Live addresses prosumer and professional audio, such ads DJ kits, mixing, and conferencing. They both work with a range of operating systems, support a variety of audio formats and interfaces, including USB type C.

DSP support in the xCORE-Audio/ Hi-Res is aimed at applications like surround sound and karaoke while that in the xCORE-Audio/Live is aimed at audio mixing and post-processing pipelines. And the company points out that pricing starts at less than $2.00 in high volume.

An in-depth report on this will follow.

Leave a Reply

featured blogs
Apr 4, 2020
That metaphorical '€œboing'€ sound you hear, figuratively speaking, is a symbolical ball allegorically landing on Chewy'€™s side of the illusory net....
Apr 3, 2020
Mentor’s Xpedition® IC Packaging design tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB layout with solutions for Chip/Package/PCB prototyping and co-design. They also deliver a complete solution for High Density Advan...
Apr 3, 2020
[From the last episode: We saw some of the mistakes that can cause programs to fail and to breach security and/or privacy.] We'€™ve seen how having more than one program or user resident as a '€œtenant'€ in a server in the cloud can create some challenges '€“ at leas...
Apr 2, 2020
There are many historical innovations that are the product of adversity, and the current situation is an extreme example.  While it is not the first time that humanity has faced a truly global challenge like the COVID-19 pandemic, this time the world is connected by tech...

Featured Video

Automotive Trends Driving New SoC Architectures -- Synopsys

Sponsored by Synopsys

Today’s automotive trends are driving new design requirements for automotive SoCs targeting ADAS, gateways, connected cars and infotainment. Find out why it is essential to use pre-designed, pre-verified, reusable automotive-optimized IP to meet such new requirements and accelerate design time.

Drive Your Next Design to Completion Today with DesignWare IP® for Automotive SoCs