editor's blog
Subscribe Now

Calxeda Isn’t Dead Yet

Remember Calxeda? The chipmaker that was going to do super power-efficient server chips based on ARM? Well, that company went under a year ago, but their technology, and some of their personnel, have resurfaced under a new name: Silver Lining Systems.

The new company’s website is barely more than a placeholder, but it does credit Calxeda with developing its technology. It also mentions Foxconn prominently, the Chinese contract manufacturer. The Foxconn afiliation suggests that either it or Silver Lining will be making full server systems, not just chips.

Leave a Reply

featured blogs
Jun 15, 2021
Samtec Flyover® Twinax Cable assemblies allow designers to extend signal reach and density, enabling 112 Gbps PAM4 performance. Samtec Flyover systems are commonly used in mid-board applications, with a cable assembly connector located next to the chip. The signal path ...
Jun 15, 2021
We share key automotive cybersecurity considerations for connected vehicle technology such as automotive WiFi & Bluetooth, along with NHTSA best practices. The post Closing the 'Door' on Remote Attackers by Securing Wireless Paths into Vehicles appeared first on From Si...
Jun 15, 2021
At the recent TSMC 2021 Online Technology Symposium, the keynote to open the show was delivered by Dr C. C. Wei, TSMC's CEO. In addition to C.C. himself, there were guest appearances by Lisa Su,... [[ Click on the title to access the full blog on the Cadence Community s...
Jun 14, 2021
By John Ferguson, Omar ElSewefy, Nermeen Hossam, Basma Serry We're all fascinated by light. Light… The post Shining a light on silicon photonics verification appeared first on Design with Calibre....

featured video

Reduce Analog and Mixed-Signal Design Risk with a Unified Design and Simulation Solution

Sponsored by Cadence Design Systems

Learn how you can reduce your cost and risk with the Virtuoso and Spectre unified analog and mixed-signal design and simulation solution, offering accuracy, capacity, and high performance.

Click here for more information about Spectre FX Simulator

featured paper

An FAQ about the Matter connectivity standard from TI

Sponsored by Texas Instruments

Formerly Project CHIP, Matter is a new connectivity standard that runs on Thread and Wi-Fi network layers to provide a unified application layer for connected devices. Read this article to discover how you can get started with Matter and TI.

Click to read more

Featured Chalk Talk

Next Generation Connectivity and Control Concepts for Industry 4.0

Sponsored by Mouser Electronics and Molex

Industry 4.0 promises major improvements in terms of efficiency, reduced downtime, automation, monitoring, and control. But Industry 4.0 also demands a new look at our interconnect solutions. In this episode of Chalk Talk, Amelia Dalton chats with Mark Schuerman of Molex about Industry 4.0 and how to choose the right connectors for your application.

Click here for more information about Molex Industry 4.0 Solutions