editor's blog
Subscribe Now

BSIMProPlus Gets a Makeover

Seems like there are two kinds of EDA tool announcements. Most of them introduce new capabilities – support for a new process node or a new lithography technique or new precision. But occasionally you get what I’ll call the “re-writes.” This is where folks at the EDA company look ahead and realize that their underlying infrastructure and engines, while once quite capable, are starting to buckle under the weight of the ever-increasing load.

So, even though you mostly want to support new stuff, occasionally you’ve got to refurbish the infrastructure. That can take years to do, but, if done right, you set yourself up for years to come. (And then, yeah, you’ll probably have to do it again.)

GUI.jpgProPlus’s latest BSIMProPlus release has that feel. They say they’ve set themselves up for the next 20 years. New GUI and everything.

Of course, this isn’t just about doing old stuff better; it comes with a payoff in new capabilities. They’re claiming:

  • Better support for 16/14-nm FinFETs
  • Support for sub-28-nm FDSOI
  • Process variation modeling
  • A three-fold increase in speed

But the other piece of it is taking disparate tools for slightly different tasks and unifying them under the new GUI. In addition to integrating their NanoSpice engine more tightly, they now have one environment for doing

  • IV/CV modeling
  • RF modeling
  • 1/f and thermal noise analysis
  • Modeling layout-dependent effects (LDE)
  • Statistical and corner analysis
  • Reliability analysis
  • Development of custom models

You can find out more in their announcement.

 

(Image courtesy ProPlus.)

Leave a Reply

featured blogs
Jul 6, 2022
With the DRAM fabrication advancing from 1x to 1y to 1z and further to 1a, 1b and 1c nodes along with the DRAM device speeds going up to 8533 for Lpddr5/8800 for DDR5, Data integrity is becoming a... ...
Jul 6, 2022
Design Automation Conference (DAC) 2022 is almost here! Explore EDA and cloud design tools, autonomous systems, AI, and more with our experts in San Francisco. The post DAC 2022: A Glimpse into the World of Design Automation from the Cloud to Cryogenic Computing appeared fir...
Jun 28, 2022
Watching this video caused me to wander off into the weeds looking at a weird and wonderful collection of wheeled implementations....

featured video

Multi-Vendor Extra Long Reach 112G SerDes Interoperability Between Synopsys and AMD

Sponsored by Synopsys

This OFC 2022 demo features Synopsys 112G Ethernet IP interoperating with AMD's 112G FPGA and 2.5m DAC, showcasing best TX and RX performance with auto negotiation and link training.

Learn More

featured paper

Addressing high-voltage design challenges with reliable and affordable isolation tech

Sponsored by Texas Instruments

Check out TI’s new white paper for an overview of galvanic isolation techniques, as well as how to improve isolated designs in electric vehicles, grid infrastructure, factory automation and motor drives.

Click to read more

featured chalk talk

Sensor Technologies Here to Stay: Post-pandemic

Sponsored by Infineon

Today sensor technology has become integral to our everyday lives. And in the future, sensor technology will mean even more than it does today. In this episode of Chalk Talk, Amelia Dalton chats with David Jones from Infineon about the future of sensor technologies and how they are going to impact our lives in the post-pandemic world. They investigate how miniaturization, built-in antennas in-package and the evolution of radar technology have helped usher in a whole new era of sensing technologies and how all of this and more will help us live healthier and happier lives.

Click here for more information about Infineon's sensor technology portfolio