editor's blog
Subscribe Now

Move over Internet toaster: the wireless pan lid is here

I am sure that it is not April 1st, so the release I got last week from Nordic Semiconductor has to be legitimate. A company in Slovenia is using one of  Nordics chips to provide communication between the cooking hob and pot and pan lids.

To quote

“In operation, the IQcook hob continuously monitors sensors embedded into the pot and pan lids (any type of cookware suitable for induction hobs can be used on the IQcook appliance) to allow automatic optimization and automation of the five most common types of hob-based cooking process: steam cooking, cooking with large amounts of water (e.g. pasta or soup), slow cooking (e.g. stews), deep frying, and grilling. After selecting the desired cooking mode, the sensor installed on the pot/pan lid is activated by a simple touch.”

And I thought the barbecue sensor and iPhone app was a culinary step t.o far

Leave a Reply

featured blogs
Jul 25, 2021
https://youtu.be/cwT7KL4iShY Made on "a tropical beach" Monday: Aerospace and Defense Systems Day...and DAU Tuesday: 75 Years of the Microprocessor Wednesday: CadenceLIVE Cloud Panel... [[ Click on the title to access the full blog on the Cadence Community site. ]]...
Jul 24, 2021
Many modern humans have 2% Neanderthal DNA in our genomes. The combination of these DNA snippets is like having the ghost of a Neanderthal in our midst....
Jul 23, 2021
Synopsys co-CEO Aart de Geus explains how AI has become an important chip design tool as semiconductor companies continue to innovate in the SysMoore Era. The post Entering the SysMoore Era: Synopsys Co-CEO Aart de Geus on the Need for AI-Designed Chips appeared first on Fro...
Jul 9, 2021
Do you have questions about using the Linux OS with FPGAs? Intel is holding another 'Ask an Expert' session and the topic is 'Using Linux with Intel® SoC FPGAs.' Come and ask our experts about the various Linux OS options available to use with the integrated Arm Cortex proc...

featured video

Breakthrough FPGA news from Intel

Sponsored by Intel

As part of the numerous portfolio announcements associated with the launch of the 3rd Gen Intel® Xeon® Scalable processor, Intel also disclosed some breakthrough FPGA news: Intel® Agilex™ FPGAs now deliver industry-leading power efficiency and performance.

Click here for more information about Intel® Agilex™ FPGAs.

featured paper

Hyperconnectivity and You: A Roadmap for the Consumer Experience

Sponsored by Cadence Design Systems

Will people’s views about hyperconnectivity and hyperscale computing affect requirements for your next system or IC design? Download the latest Cadence report for how consumers view hyperscale computing’s impact on cars, mobile devices, and health.

Click to read more

featured chalk talk

Nordic Cellular IoT

Sponsored by Mouser Electronics and Nordic Semiconductor

Adding cellular connectivity to your IoT design is a complex undertaking, requiring a broad set of engineering skills and expertise. For most teams, this can pose a serious schedule challenge in getting products out the door. In this episode of Chalk Talk, Amelia Dalton chats with Kristian Sæther of Nordic Semiconductor about the easiest path to IoT cellular connectivity with the Nordic nRF9160 low-power system-in-package solution.

Click here for more information about Nordic Semiconductor nRF91 Cellular IoT Modules