editor's blog
Subscribe Now

TSVs: Like Vias, Only 1000X Deeper

We recently looked at Applied Materials’ solution to the challenges of lining small vias: using cobalt. But those are through-dielectric vias. What about through-silicon vias (TSVs)? After all, they can be a thousand times deeper than a standard via, so if a standard via is hard to cover, imagine how hard it must be for a TSV.

Of course, we’re talking a wider via, but AMAT says that standard physical vapor deposition (PVD) tools do an inadequate job of coating the TSVs when applying the barrier, for lots of the same reasons we discussed in the cobalt story.

Their solution to the TSV issue isn’t quite as radical as a new metal; it involves tightening up the angle of dispersion for the metals, providing better coverage. With better coverage, the barrier can also be made thinner, saving cost. A thinner layer is faster to deposit, improving throughput (and reducing cost).

Figure.png

 

(Image courtesy Applied Materials)

In addition, they’ve built a production-worthy chamber for use with titanium rather than the more typical “proven” tantalum. Titanium apparently being cheaper than tantalum. Both can be integrated with the copper seed.

You can read more about their Ventura PVD in their announcement.

Leave a Reply

featured blogs
Jan 17, 2020
I once met Steve Wozniak, or he once met me (it's hard to remember the nitty-gritty details)....
Jan 17, 2020
[From the last episode: We saw how virtual memory helps resolve the differences between where a compiler thinks things will go in memory and the real memories in a real system.] We'€™ve talked a lot about memory '€“ different kinds of memory, cache memory, heap memory, vi...
Jan 16, 2020
While Samtec started as a connector company with a focus on two-piece, pin-and-socket board stacking systems, High-Speed Board Stacking connectors and High-Speed Cable Assemblies now make up a significant portion of our sales. To support development in this area, in December ...
Jan 16, 2020
Betting on Hydrogen-Powered Cars On-demand DRC within P&R cuts closure time in half for MaxLinear Functional Safety Verification For AV SoC Designs Accelerated With Advanced Tools Automating the pain out of clock domain crossing verification Mentor unpacks LVS and LVL iss...

Featured Video

RedFit IDC SKEDD Connector

Sponsored by Wurth Electronics and Mouser Electronics

Why attach a header connector to your PCB when you really don’t need one? If you’re plugging a ribbon cable into your board, particularly for a limited-use function such as provisioning, diagnostics, or testing, it can be costly and clunky to add a header connector to your BOM, and introduce yet another component to pick and place. Wouldn’t it be great if you could plug directly into your board with no connector required on the PCB side? In this episode of Chalk Talk, Amelia Dalton chats with Ben Arden from Wurth Electronics about Redfit, a slick new connector solution that plugs directly into standard via holes on your PCB.

Click here for more information about Wurth Electronics REDFIT IDC SKEDD Connector