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On the Scene: Project Ara

The race hasn’t yet begun. In fact, we’re not even on the starting block, but the rule book for this race – the race to the next major innovative mobile platform (smartphone) has been drafted and teams are starting to assemble. Google’s Project Ara, the world’s first completely modular smartphone is coming, and the modules will be designed by… YOU! On your mark. Get set. Design!

 

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Simplify building automation designs with MSP430

Sponsored by Texas Instruments

Smart building automation requires simple, flexible designs. With integrated, high-performance signal chain, MSP430 MCUs can enable high-accuracy motion detection, sensing and motor control to take performance and efficiency to the next level.

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featured paper

Voltage Balancing Techniques for Series Supercapacitor Connections

Sponsored by Maxim Integrated (now part of Analog Devices)

For applications where supercapacitors need to be charged to more than 2.5V or 2.7V, engineers are forced to connect multiple supercapacitors in a series. This application note reviews the voltage balancing techniques in series supercapacitor connections for Maxim’s MAX38886/MAX38888/MAX38889 backup regulators.

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Accelerating Physical Verification Productivity Part Two

Sponsored by Synopsys

Physical verification of IC designs at today’s advanced process nodes requires an immense amount of processing power. But, getting your design and verification tools to take full advantage of the compute resources available can be a challenge. In this episode of Chalk Talk, Amelia Dalton chats with Manoz Palaparthi of Synopsys about dramatically improving the performance of your physical verification process. 

Click here for more information about Physical Verification using IC Validator