Three little letters that rule the world. They are but the sun and we are but the moon. Oh IoT, where would we be without you? 2012 perhaps? In this episode of “On The Scene” we examine a wide range of IoT small-form-factor boards with Cliff Ortmeyer of Element14. Join us while we tour Element14’s booth at this year’s EELive! expo, and get chatty with Cliff.
 3D-IC Design Challenges and RequirementsSponsored by Cadence Design Systems While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies. |
