editor's blog
Subscribe Now

More MEMS Microphone Options

Everything’s going HD these days, and audio is no exception. That means that everything in the audio chain, from microphone to speaker, has to step up its game.

Akustica announced their first HD microphone in late 2012; they recently announced some new additions to the family.

And once again, packaging demonstrates that it refuses to be taken for granted with microphones. This is illustrated in two different aspects of the new Akustica offerings.

First is the notion of where the port goes. Port location makes a difference in the acoustics, but it also impacts designers that want more flexibility in locating and mounting the mics on very small boards like those inside phones. This is even truer given that multiple mics are becoming the rule for noise cancellation and other reasons.

So sometimes a designer wants to use a top-ported mic; sometimes a bottom-ported one. The thing is, apparently the audio software strongly prefers that the microphones be identical (or close to it). Changing the porting can screw that up, either resulting in tougher software or less placement flexibility for the designer.

So Akustica has announced matched top- and bottom-ported microphones. The idea is that you can use either one and they’ll still be close to “identical” (±1%). They accomplish the matching with a combination of tight manufacturing tolerances and a calibration step at test. Both the MEMS element itself and the accompanying ASIC are optimized.

The second package impact – and die strategy – has to do with the package size. With most every IC or sensor, smaller is always better (ignoring price). Not so with microphones. Given more space, you can do a two-die solution, optimizing MEMS and ASIC separately. You also have more cavity room in the package, which is important for sound quality.

So, while they’ve announced their matched high-performance HD mics, they also announced what they say is the smallest microphone around, in a 2×3 mm2 package. It is said to have good performance, but does compromise somewhat from the larger devices to achieve the smaller size.

You can read more about these in their announcement.

Leave a Reply

featured blogs
Sep 20, 2021
As it seems to be becoming a (bad) habit, This Week in CFD is presented here as Last Week in CFD. But that doesn't make the news any less relevant. Great article on wind tunnels because they go... [[ Click on the title to access the full blog on the Cadence Community si...
Sep 18, 2021
Projects with a steampunk look-and-feel incorporate retro-futuristic technology and aesthetics inspired by 19th-century industrial steam-powered machinery....
Sep 15, 2021
Learn how chiplets form the basis of multi-die HPC processor architectures, fueling modern HPC applications and scaling performance & power beyond Moore's Law. The post What's Driving the Demand for Chiplets? appeared first on From Silicon To Software....
Aug 5, 2021
Megh Computing's Video Analytics Solution (VAS) portfolio implements a flexible and scalable video analytics pipeline consisting of the following elements: Video Ingestion Video Transformation Object Detection and Inference Video Analytics Visualization   Because Megh's ...

featured video

Gesture Detection for Automotive In-Cabin Applications

Sponsored by Texas Instruments

See how using 60GHz radar for automotive in-cabin gesture is ideal due to its small size and ability to sense through various materials. Applications using gesture control include changing radio stations, answering phone calls, opening windows, and more.

Click to learn more about gesture detection using 60GHz mmWave radar sensors

featured paper

3 key design decisions for any desktop 3D printer design

Sponsored by Texas Instruments

Learn about three important design considerations to take your 3D print design to the next level.

Click to read more

featured chalk talk

Benefits and Applications of Immersion Cooling

Sponsored by Samtec

For truly high-performance systems, liquid immersion cooling is often the best solution. But, jumping into immersion cooling requires careful consideration of elements such as connectors. In this episode of Chalk Talk, Amelia Dalton chats with Brian Niehoff of Samtec about connector solutions for immersion-cooled applications.

Click here for more information about Samtec immersion cooling solutions