editor's blog
Subscribe Now

More Common-Process MEMS

Last year we took a look at a couple of proposals for universal processes from Teledyne/DALSA and CEA-Leti that could be used to make many different MEMS elements, trying to move past the “one product, one process” trap. We’ve also reported on the AMFitzgerald/Silex modular approach and their first device.

Well, the first design using CEA-Leti’s M&NEMS process has rolled out: a single MEMS chip with three accelerometers and three gyroscopes designed and implemented by Tronics. They’re not quite the smallest of the 6-DOF sensors, but they claim that, with more optimization, they will be. Right now their die size is 4 mm2. And they say that all main parameters are on track with their simulation models.

But this is just the first functional version; they’re going back to work some more while, at the same time, giving it a companion ASIC, releasing them at the end of this year.

They’re also using the same process to create a 9-DOF sensor set, with all of the sensors on a single MEMS chip. Also for release at the end of the year. And, the idea is, that, if they wanted to, they could also include a pressure sensor and a microphone, since they can all presumably be made on this same process. Yeah, you might wonder whether integrating a microphone with those other sensors has value; even if it doesn’t, being able to make it separately using the same process as the n-DOF chip still brings a huge level of manufacturing simplification.

These efforts, if successful, could represent a fresh breath of efficiency for some of the oldest sensors in the MEMS world. The industry also has new MEMS elements in the works, like gas sensors and such. If a standard process like this could be used for new sensors as well, then at some point new sensors could launch on standard processes rather than having to do the “one process” thing first like accelerometers and their ilk have done.

There are those who believe that these standard processes are too restrictive to allow the design of sensors with arbitrary characteristics. We’ll continue to keep an eye on this stuff to see whether these common-process skeptics can eventually be appeased or whether they’ll be proven correct.

Check out the details in Tronics’s release.

Leave a Reply

featured blogs
Sep 18, 2021
Projects with a steampunk look-and-feel incorporate retro-futuristic technology and aesthetics inspired by 19th-century industrial steam-powered machinery....
Sep 17, 2021
Dear BoardSurfers, I want to unapologetically hijack the normal news and exciting feature information that you are accustomed to reading about in the world of PCB Design blogs to eagerly let you know... [[ Click on the title to access the full blog on the Cadence Community s...
Sep 15, 2021
Learn how chiplets form the basis of multi-die HPC processor architectures, fueling modern HPC applications and scaling performance & power beyond Moore's Law. The post What's Driving the Demand for Chiplets? appeared first on From Silicon To Software....
Aug 5, 2021
Megh Computing's Video Analytics Solution (VAS) portfolio implements a flexible and scalable video analytics pipeline consisting of the following elements: Video Ingestion Video Transformation Object Detection and Inference Video Analytics Visualization   Because Megh's ...

featured video

ARC® Processor Virtual Summit 2021

Sponsored by Synopsys

Designing an embedded SoC? Attend the ARC Processor Virtual Summit on Sept 21-22 to get in-depth information from industry leaders on the latest ARC processor IP and related hardware and software technologies that enable you to achieve differentiation in your chip or system design.

Click to read more

featured paper

Configure the charge and discharge current separately in a reversible buck/boost regulator

Sponsored by Maxim Integrated (now part of Analog Devices)

The design of a front-end converter can be made less complicated when minimal extra current overhead is required for charging the supercapacitor. This application note explains how to configure the reversible buck/boost converter to achieve a lighter impact on the system during the charging phase. Setting the charge current requirement to the minimum amount keeps the discharge current availability intact.

Click to read more

featured chalk talk

Time Sensitive Networking for Industrial Automation

Sponsored by Mouser Electronics and Intel

In control applications with strict deterministic requirements, such as those found in automotive and industrial domains, Time Sensitive Networking offers a way to send time-critical traffic over a standard Ethernet infrastructure. This enables the convergence of all traffic classes and multiple applications in one network. In this episode of Chalk Talk, Amelia Dalton chats with Josh Levine of Intel and Patrick Loschmidt of TTTech about standards, specifications, and capabilities of time-sensitive networking (TSN).

Click here for more information about Intel Cyclone® V FPGAs