editor's blog
Subscribe Now

TSensors Roadmap Takes Shape

Last fall, an effort was started to drive the MEMS business (or sensors in general) to the point where a trillion sensors are shipped yearly. We covered the TSensors event, and we promised to update.

As a quick recap, the approach here is to identify high-yield applications and then focus in on those to remove barriers (largely, but not exclusively, cost). So the current process is to establish what those applications are going to be, and then have a chairperson for each application driving the writing of a chapter, to be contributed by various people.

The topics selected are as follows:

  • Noninvasive fitness-wellness-health monitoring (possibly to be expanded to include animal health)
  • Noninvasive chronic disease detection and monitoring
  • Minimally invasive fitness-wellness-health monitoring (possibly to be expanded to include animal health)
  • Personal imaging
  • Computer sensors (smell, taste, color, biometrics, etc.)
  • Environment sensing
  • Sensors for food production
  • Smart grid/Energy/Harsh environment sensors
  • Energy harvesting
  • Ultralow power wireless communication
  • Network infrastructure for Internet of Things

That’s a lot of stuff, covering a lot of ground.

One thing that’s clear is that there is room for more contribution by authors and even chapter chairs, at least as of the last update I saw. So if anyone is interested in participating, contact information is available on the TSensors website.

Leave a Reply

featured blogs
May 24, 2024
Could these creepy crawly robo-critters be the first step on a slippery road to a robot uprising coupled with an insect uprising?...
May 23, 2024
We're investing in semiconductor workforce development programs in Latin America, including government and academic partnerships to foster engineering talent.The post Building the Semiconductor Workforce in Latin America appeared first on Chip Design....

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

FleClear: TDK’s Transparent Conductive Ag Film
Sponsored by Mouser Electronics and TDK
In this episode of Chalk Talk, Amelia Dalton and Chris Burket from TDK investigate the what, where, and how of TDK’s transparent conductive Ag film called FleClear. They examine the benefits that FleClear brings to the table when it comes to transparency, surface resistance and haze. They also chat about how FleClear compares to other similar solutions on the market today and how you can utilize FleClear in your next design.
Feb 7, 2024
14,917 views