editor's blog
Subscribe Now

TSensors Roadmap Takes Shape

Last fall, an effort was started to drive the MEMS business (or sensors in general) to the point where a trillion sensors are shipped yearly. We covered the TSensors event, and we promised to update.

As a quick recap, the approach here is to identify high-yield applications and then focus in on those to remove barriers (largely, but not exclusively, cost). So the current process is to establish what those applications are going to be, and then have a chairperson for each application driving the writing of a chapter, to be contributed by various people.

The topics selected are as follows:

  • Noninvasive fitness-wellness-health monitoring (possibly to be expanded to include animal health)
  • Noninvasive chronic disease detection and monitoring
  • Minimally invasive fitness-wellness-health monitoring (possibly to be expanded to include animal health)
  • Personal imaging
  • Computer sensors (smell, taste, color, biometrics, etc.)
  • Environment sensing
  • Sensors for food production
  • Smart grid/Energy/Harsh environment sensors
  • Energy harvesting
  • Ultralow power wireless communication
  • Network infrastructure for Internet of Things

That’s a lot of stuff, covering a lot of ground.

One thing that’s clear is that there is room for more contribution by authors and even chapter chairs, at least as of the last update I saw. So if anyone is interested in participating, contact information is available on the TSensors website.

Leave a Reply

featured blogs
Apr 9, 2021
You probably already know what ISO 26262 is. If you don't, then you can find out in several previous posts: "The Safest Train Is One that Never Leaves the Station" History of ISO 26262... [[ Click on the title to access the full blog on the Cadence Community s...
Apr 8, 2021
We all know the widespread havoc that Covid-19 wreaked in 2020. While the electronics industry in general, and connectors in particular, took an initial hit, the industry rebounded in the second half of 2020 and is rolling into 2021. Travel came to an almost stand-still in 20...
Apr 7, 2021
We explore how EDA tools enable hyper-convergent IC designs, supporting the PPA and yield targets required by advanced 3DICs and SoCs used in AI and HPC. The post Why Hyper-Convergent Chip Designs Call for a New Approach to Circuit Simulation appeared first on From Silicon T...
Apr 5, 2021
Back in November 2019, just a few short months before we all began an enforced… The post Collaboration and innovation thrive on diversity appeared first on Design with Calibre....

featured video

Meeting Cloud Data Bandwidth Requirements with HPC IP

Sponsored by Synopsys

As people continue to work remotely, demands on cloud data centers have never been higher. Chip designers for high-performance computing (HPC) SoCs are looking to new and innovative IP to meet their bandwidth, capacity, and security needs.

Click here for more information

featured paper

Understanding the Foundations of Quiescent Current in Linear Power Systems

Sponsored by Texas Instruments

Minimizing power consumption is an important design consideration, especially in battery-powered systems that utilize linear regulators or low-dropout regulators (LDOs). Read this new whitepaper to learn the fundamentals of IQ in linear-power systems, how to predict behavior in dropout conditions, and maintain minimal disturbance during the load transient response.

Click here to download the whitepaper

Featured Chalk Talk

Keeping Your Linux Device Secure

Sponsored by Siemens Digital Industries Software

Embedded security is an ongoing process, not a one-time effort. Even after your design is shipped, security vulnerabilities are certain to be discovered - even in things like the operating system. In this episode of Chalk Talk, Amelia Dalton chats with Kathy Tufto from Mentor - a Siemens business, about how to make a plan to keep your Linux-based embedded design secure, and how to respond quickly when new vulnerabilities are discovered.

More information about Mentor Embedded Linux®