editor's blog
Subscribe Now

It might have to do with governm

It might have to do with government restrictions on devices that can be used for targeting people – the Panasonic GridEYE is considered a “controlled device” here in the USA. I was going to do a product based on it (i.e. it can tell you how many people are in a room) but the usage restrictions made it too difficult to sell.
So, I just open-sourced the project
http://bit.ly/1clb03r
and people can build their own if they want to try it out.

Leave a Reply

featured blogs
Dec 6, 2023
Optimizing a silicon chip at the system level is crucial in achieving peak performance, efficiency, and system reliability. As Moore's Law faces diminishing returns, simply transitioning to the latest process node no longer guarantees substantial power, performance, or c...
Dec 6, 2023
Explore standards development and functional safety requirements with Jyotika Athavale, IEEE senior member and Senior Director of Silicon Lifecycle Management.The post Q&A With Jyotika Athavale, IEEE Champion, on Advancing Standards Development Worldwide appeared first ...
Nov 6, 2023
Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....

featured video

Dramatically Improve PPA and Productivity with Generative AI

Sponsored by Cadence Design Systems

Discover how you can quickly optimize flows for many blocks concurrently and use that knowledge for your next design. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and generative AI features within Cadence Cerebrus Explorer will intelligently optimize the design to meet the power, performance, and area (PPA) goals in a completely automated way.

Click here for more information

featured paper

3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.

Click to read more

featured chalk talk

Electrical Connectors for Hermetically Sealed Applications
Many hermetic chambers today require electrical pathways to provide internal equipment with power, data or signals, or to receive data and signals from equipment within the chamber. In this episode of Chalk Talk, Amelia Dalton and Brad Taras from Cinch Connectivity Solutions explore the role that seals and connectors play in the performance of hermetic chambers. They examine the methodologies to determine hermetic seal leaks, the benefits of epoxy hermetic seals, and how Cinch Connectivity’s epoxy-based seals and hermetic connectors can add value to your next design.
Aug 22, 2023
12,758 views