editor's blog
Subscribe Now

A New Piezoelectric Oscillator

A few months ago, we looked at Sand 9’s initial announcement. They had laid out 3 families at that point: a basic resonator (TM061), a temperature-sensing resonator (TM361), and a “roadmap” family for temperature-sensing oscillators. Well, they recently announced a new device that goes in yet a new family: temperature-compensated oscillators – the TM651. When chip-scale packaged, they claim it’s the smallest oscillator in the world (although an LGA is also available).

They’ve come out swinging at their performance versus quartz, in particular the latter’s susceptibility to so-called “activity dips,” which we covered in the prior piece. But they’re also comparing themselves to other MEMS – and, in particular, electrostatic – oscillators. They say:

  • The filter and noise are better than any MEMS oscillator and competitive with quartz;
  • They have 250-ps edge rates as compared to about 1 ns for quartz;
  • Their vibration immunity is an order of magnitude better than quartz;
  • They have 1/15th the drift of other silicon MEMS due to their analog compensation, which is smoother than digital;
  • They can achieve higher frequencies without a DLL, which quartz needs for frequencies above 50 MHz;
  • They don’t have quartz’s finicky start-up time (and, apparently, start-up can occasionally fail outright with quartz);
  • They have better electromechanical coupling than electrostatic MEMS devices because they’re piezoelectric (with the presumed effect that the coupling happens intrinsically within the material as opposed to being between two distinct mechanical members);
  • They have larger transduction area, which, counter-intuitively, reduces die area (presumably because of better intrinsic sensitivity);
  • They have no air gaps, vs. those used with electrostatic devices (which goes to coupling efficiency);
  • They operate off of a lower voltage;
  • They have linear power vs. non-linear for electrostatic, giving them better noise performance;
  • They can work with a customer to have the customer’s electronics co-packaged with their resonator for better integration, which isn’t possible with quartz.

That’s a lot of claims.

Their electronics are in the cap wafer. The bonding is done wafer-to-wafer; both the MEMS and ASIC see very high yields (in fact, wafer probing on the MEMS die is done only on a wafer sample basis to see if it looks like there’s a problem with the lot). GlobalFoundries does this for them.

You can read more in their announcement.

Leave a Reply

featured blogs
Sep 22, 2021
'μWaveRiders' 是ä¸ç³»åˆ—æ—¨å¨æŽ¢è®¨ Cadence AWR RF 产品的博客,按æˆæ›´æ–°ï¼Œå…¶å†…容涵盖 Cadence AWR Design Environment æ新的核心功能,专题视频ï¼...
Sep 22, 2021
3753 Cruithne is a Q-type, Aten asteroid in orbit around the Sun in 1:1 orbital resonance with the Earth, thereby making it a co-orbital object....
Sep 21, 2021
Learn how our high-performance FPGA prototyping tools enable RTL debug for chip validation teams, eliminating simulation/emulation during hardware debugging. The post High Debug Productivity Is the FPGA Prototyping Game Changer: Part 1 appeared first on From Silicon To Softw...
Aug 5, 2021
Megh Computing's Video Analytics Solution (VAS) portfolio implements a flexible and scalable video analytics pipeline consisting of the following elements: Video Ingestion Video Transformation Object Detection and Inference Video Analytics Visualization   Because Megh's ...

featured video

Enter the InnovateFPGA Design Contest to Solve Real-World Sustainability Problems

Sponsored by Intel

The Global Environment Facility (GEF) Small Grants Programme, implemented by the U.N. Development Program, is collaborating with the #InnovateFPGA contest to support 7 funded projects that are looking for technical solutions in biodiversity, sustainable agriculture, and marine conservation. Contestants have access to the Intel® Cyclone® V SoC FPGA in the Cloud Connectivity Kit, Analog Devices plug-in boards, and Microsoft Azure IoT.

Learn more about the contest and enter here by September 30, 2021

featured paper

Ultra Portable IO On The Go

Sponsored by Maxim Integrated (now part of Analog Devices)

The Go-IO programmable logic controller (PLC) reference design (MAXREFDES212) consists of multiple software configurable IOs in a compact form factor (less than 1 cubic inch) to address the needs of industrial automation, building automation, and industrial robotics. Go-IO provides design engineers with the means to rapidly create and prototype new industrial control systems before they are sourced and constructed.

Click to read more

featured chalk talk

Time Sensitive Networking for Industrial Automation

Sponsored by Mouser Electronics and Intel

In control applications with strict deterministic requirements, such as those found in automotive and industrial domains, Time Sensitive Networking offers a way to send time-critical traffic over a standard Ethernet infrastructure. This enables the convergence of all traffic classes and multiple applications in one network. In this episode of Chalk Talk, Amelia Dalton chats with Josh Levine of Intel and Patrick Loschmidt of TTTech about standards, specifications, and capabilities of time-sensitive networking (TSN).

Click here for more information about Intel Cyclone® V FPGAs