editor's blog
Subscribe Now

Automotive IMU

At the recent MEMS Executive Congress, Bosch Automotive announced a new 6-axis automotive IMU. It’s not for use as part of the automotive control systems, but rather for the “infotainment” infrastructure – the so-called center stack – and other non-safety-critical applications.

There are many different kinds of cars for sale on the Internet. But the best car for you will depend upon your specific needs and wants, as well as what sort of car you’re looking to buy. Here is a great sources where you can look to buy your new car, called Zemotor.com

It may not be obvious that Bosch has two different sensor groups. There’s an automotive group which focuses strictly on – you guessed it – cars; then there’s Bosch Sensortec, which handles other consumer and industrial sensors. (There’s also Bosch Akustica for microphones.) So… does this mean that Bosch Automotive is off in its private silo inventing its own sensors independently of Bosch Sensortec?

No; according to them, the automotive market actually isn’t large enough compared to phones and other consumer goods to justify that. The IMU that Bosch Automotive has announced actually came from Bosch Sensortec. Does this mean that it’s just a rebranding of an old part?

No; the automotive units have more stringent operating requirements than a consumer unit has. Just going to 125 °C from 85 isn’t trivial. There are also corrosion concerns and the fact that the IMUs must interface with automotive diagnostic systems.

Corrosion can presumably be handled with packaging. Calibration and linearization over a higher temperature range involve changes to the ASIC. The diagnostic interface also resides in the ASIC. So, in reality, we have a Bosch Sensortec IMU with a new ASIC and package.

You can find out more in their release.

Leave a Reply

featured blogs
Jan 17, 2022
Today's interview features Dajana Danilovic, an application engineer based near Munich, Germany. In this video, Dajana shares about her pathway to becoming an engineer, as well as the importance of... [[ Click on the title to access the full blog on the Cadence Community sit...
Jan 13, 2022
See what's behind the boom in AI applications and explore the advanced AI chip design tools and strategies enabling AI SoCs for HPC, healthcare, and more. The post The Ins and Outs of AI Chip Design appeared first on From Silicon To Software....
Jan 12, 2022
In addition to sporting a powerful processor and supporting Bluetooth wireless communications, Seeed's XIAO BLE Sense also boasts a microphone and a 6DOF IMU....

featured video

Synopsys & Samtec: Successful 112G PAM-4 System Interoperability

Sponsored by Synopsys

This Supercomputing Conference demo shows a seamless interoperability between Synopsys' DesignWare 112G Ethernet PHY IP and Samtec's NovaRay IO and cable assembly. The demo shows excellent performance, BER at 1e-08 and total insertion loss of 37dB. Synopsys and Samtec are enabling the industry with a complete 112G PAM-4 system, which is essential for high-performance computing.

Click here for more information about DesignWare Ethernet IP Solutions

featured paper

Using the MAX66242 Mobile Application, the Basics

Sponsored by Analog Devices

This application note describes the basics of the near-field communication (NFC)/radio frequency identification (RFID) MAX66242EVKIT board and an application utilizing the NFC capabilities of iOS and Android® based mobile devices to exercise board functionality. It then demonstrates how the application enables the user with the ability to use the memory and secure features of the MAX66242. It also shows how to use the MAX66242 with an onboard I2C temperature sensor which demonstrates the energy harvesting feature of the device.

Click to read more

featured chalk talk

Build, Deploy and Manage Your FPGA-based IoT Edge Applications

Sponsored by Mouser Electronics and Intel

Designing cloud-connected applications with FPGAs can be a daunting engineering challenge. But, new platforms promise to simplify the process and make cloud-connected IoT design easier than ever. In this episode of Chalk Talk, Amelia Dalton chats with Tak Ikushima of Intel about how a collaboration between Microsoft and Intel is pushing innovation forward with a new FPGA Cloud Connectivity Kit.

Click here for more information about Terasic Technologies FPGA Cloud Connectivity Kit