editor's blog
Subscribe Now

Miniscule IR Subsystem

As part of their recent announcement of FPGAs for sensor management, Lattice also introduced a couple of new devices for their iCE40LP family. From a device standpoint, the key here is the package: a 16-ball chip-scale-package (CSP) measuring 1.4 mm by 1.48 mm, and only 0.45 mm thick.

While this is an extraordinarily small device, and it is a general purpose device (it could even do sensor management for a couple sensors), they have some specific ideas for it. They have teamed the devices up with some IP so that, together, they constitute an infrared subsystem.

This includes logic and electronics for driving the LED, sensing an IR remote, and doing bar code emulation.

The latter is a particularly interesting application for use when trying to display a barcode on a phone for a barcode reader to detect. The problem is that the phone glass will typically reflect the IR light from the reader, preventing it from figuring out the code.

Instead, the IR LED can transmit the equivalent code, which the reader will detect. It probably won’t even know that it didn’t get the code from where it thinks it got the code.

Confused by the concept of FPGAs in a cell phone? Well, we’ve got that covered in a separate article.

You can read more about this new device as well as the new iCE40LM devices in their release.

Leave a Reply

featured blogs
Jan 18, 2021
The DIY electronics portion AliExpress website can be a time-sink for the unwary because one tempting project leads to another....
Jan 17, 2021
https://youtu.be/mKoW8ji9_g8 Made in my kitchen (camera Ziyue Zhang) Monday: Young People Program at DATE 2021 Tuesday: IEDM Opening Keynote Wednesday: Cadence/Arm Event on Optimizing High-End Arm... [[ Click on the title to access the full blog on the Cadence Community site...
Jan 14, 2021
Learn how electronic design automation (EDA) tools & silicon-proven IP enable today's most influential smart tech, including ADAS, 5G, IoT, and Cloud services. The post 5 Key Innovations that Are Making Everything Smarter appeared first on From Silicon To Software....
Jan 13, 2021
Testing is the final step of any manufacturing process, and arguably the most important, and yet it can often be overlooked.  Releasing a poorly tested product onto the market has destroyed more than one reputation for quality, and this is even more important in an age when ...

featured paper

Overcoming Signal Integrity Challenges of 112G Connections on PCB

Sponsored by Cadence Design Systems

One big challenge with 112G SerDes is handling signal integrity (SI) issues. By the time the signal winds its way from the transmitter on one chip to packages, across traces on PCBs, through connectors or cables, and arrives at the receiver, the signal is very distorted, making it a challenge to recover the clock and data-bits of the information being transferred. Learn how to handle SI issues and ensure that data is faithfully transmitted with a very low bit error rate (BER).

Click here to download the whitepaper

featured chalk talk

Minitek Microspace

Sponsored by Mouser Electronics and Amphenol ICC

With the incredible pace of automotive innovation these days, it’s important to choose the right connectors for the job. With everything from high-speed data to lighting, connectors have a huge impact on reliability, cost, and design. In this episode of Chalk Talk, Amelia Dalton chats with Glenn Heath from Amphenol ICC about the Minitek MicroSpace line of automotive- and industrial-grade connectors.

Click here for more information about Amphenol FCI Minitek MicroSpace™ Connector System