editor's blog
Subscribe Now

New Process Modeling Mechanism

Simulation is all about using the simplest possible modeling technique that gives enough accuracy to make the results useful. Simplicity typically speeds up simulation – and, in many cases, makes the problem tractable in the first place.

But at some point, the unnecessary details that the modeling abstractions hide become necessary. At that stage, if you’re lucky, you can tweak your modeling technique to allow for the now-important effects. But eventually you may to have to take a new approach.

This is what’s happened for certain very specific processes that Coventor’s SEMulator3D tool models. Their voxel approach still works for most processes, but can’t capture all the nuances of multi-etch and selective epitaxy processes. For example, in multi-etch, where multiple materials are being etched in one step, the vertical etch rates work just fine with voxels, but they can’t capture lateral bias. For selective epitaxy, crystal orientation can affect growth rates; again, this isn’t modeled well by voxels.

So they’ve added a “surface evolution” option – a completely different mathematical approach to modeling those processes. It handles multi-etch, improves the epitaxy modeling that they introduced last year, and also introduces redeposition (where etching results in deposition of the etched material elsewhere, particularly used for sidewalls) and sputtering.

They have also introduced virtual metrology capabilities that mirror the in-line process metrology that would normally be built into a physical fabrication line. This allows monitoring of critical parameters as the process is simulated just as would be done if the experiments being simulated were actually being done on physical wafers in a real fab.

You can find out more about the latest SEMulator3D version, which they say is the biggest release they’ve ever done, in their announcement.

Leave a Reply

featured blogs
Jul 1, 2022
We all look for 100% perfection and want to turn our dreams (expectations) into reality as far as we can. Are you also looking for a magic wand to turn expectation into reality? The story applies to... ...
Jun 30, 2022
Learn how AI-powered cameras and neural network image processing enable everything from smartphone portraits to machine vision and automotive safety features. The post How AI Helps Cameras See More Clearly appeared first on From Silicon To Software....
Jun 28, 2022
Watching this video caused me to wander off into the weeds looking at a weird and wonderful collection of wheeled implementations....

featured video

Demo: Achronix Speedster7t 2D NoC vs. Traditional FPGA Routing

Sponsored by Achronix

This demonstration compares an FPGA design utilizing Achronix Speedster7t 2D Network on Chip (NoC) for routing signals with the FPGA device, versus using traditional FPGA routing. The 2D NoC provides a 40% reduction in logic resources required with 40% less compile time needed versus using traditional FPGA routing. Speedster7t FPGAs are optimized for high-bandwidth workloads and eliminate the performance bottlenecks associated with traditional FPGAs.

Subscribe to Achronix's YouTube channel for the latest videos on how to accelerate your data using FPGAs and eFPGA IP

featured paper

3 key considerations for your next-generation HMI design

Sponsored by Texas Instruments

Human-Machine Interface (HMI) designs are evolving. Learn about three key design considerations for next-generation HMI and find out how low-cost edge AI, power-efficient processing and advanced display capabilities are paving the way for new human-machine interfaces that are smart, easily deployable, and interactive.

Click to read more

featured chalk talk

i.MX RT1170

Sponsored by Mouser Electronics and NXP Semiconductors

Dual Core microcontrollers can bring a lot of benefits to today’s modern embedded designs in order to keep all of our design requirements in balance. In this episode of Chalk Talk, Amelia Dalton chats with Patrick Kennedy from NXP about why newer design requirements for today’s connected embedded systems are making this balancing act even harder than ever before and how the i.MX RT1170 can help solve these problems with its heterogeneous dual cores, MIPI interface, multi-core low power strategy and SRAM PUF technology can make all the difference in your next embedded design.

Click here for More information about NXP Semiconductors i.MX RT1170 crossover microcontrollers