editor's blog
Subscribe Now

Pressing Vinyl (Or Something Similar)

You’d think a complete new technology for patterning silicon would merit a long, involved story. And yet it’s just not that complicated. (Easy for me to say…) One of the up-and-coming lithography processes under development is called “nanoimprint lithography” (NIL). It might be hard to imagine that this would work, but, just like it sounds, it involves taking a master “stamp” and impressing it into a liquid resist.

You then harden the resist with some exposure to UV light and release the master. The pattern on the wafer can then direct further more standard processing.

The crazy thing about this is that nanometer-scale features can print using a printer for stickers. You’d think that the liquid might have trouble conforming to such miniscule hollows in the template. And some of the issues you might think could arise – like parts of the pattern slumping or collapsing after the template is removed – truly are issues that are being studied and addressed.

Right now, researchers are working in the 26-nm realm (according to presentations at SPIE Litho), but they are trying to use the same process as HGST used for their hard drive project – creating working templates from a master template. Quality is still a challenge for those working templates, making this most suitable for applications having large-scale repeated features for which redundancy can be provided for repair.

The presenter from Dai Nippon Printing said that full production is targeted for two years out. We’ll continue to track it… If you get the SPIE Litho proceedings, you can find more in paper 8680-2.

Leave a Reply

featured blogs
May 8, 2024
Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...

featured video

Introducing Altera® Agilex 5 FPGAs and SoCs

Sponsored by Intel

Learn about the Altera Agilex 5 FPGA Family for tomorrow’s edge intelligent applications.

To learn more about Agilex 5 visit: Agilex™ 5 FPGA and SoC FPGA Product Overview

featured paper

Achieve Greater Design Flexibility and Reduce Costs with Chiplets

Sponsored by Keysight

Chiplets are a new way to build a system-on-chips (SoCs) to improve yields and reduce costs. It partitions the chip into discrete elements and connects them with a standardized interface, enabling designers to meet performance, efficiency, power, size, and cost challenges in the 5 / 6G, artificial intelligence (AI), and virtual reality (VR) era. This white paper will discuss the shift to chiplet adoption and Keysight EDA's implementation of the communication standard (UCIe) into the Keysight Advanced Design System (ADS).

Dive into the technical details – download now.

featured chalk talk

Switch to Simple with Klippon Relay
In this episode of Chalk Talk, Amelia Dalton and Lars Hohmeier from Weidmüller explore the what, where, and how of Weidmüller's extensive portfolio of Klippon relays. They investigate the pros and cons of mechanical relays, the benefits that the Klippon universal range of relays brings to the table, and how Weidmüller's digital selection guide can help you choose the best relay solution for your next design.
Sep 26, 2023
28,780 views