editor's blog
Subscribe Now

Photonics on Different Silicon

The use of photons as signal carriers has historically gone towards long-distance transport, either over the air (feels like waves more than photons) or within fiber. But the distances of interest have dropped dramatically, to the point where there are discussions of using silicon photonics even for on-chip signaling.

In a conversation at Semicon West with imec’s Ludo Deferm, we discussed their current work. At this point, and for at least 10 years out, he doesn’t see CMOS and photonics co-existing on the same wafer. The bottleneck right now isn’t on-chip; it’s chip-to-chip. 40-60 Gb/s internally is fine for now. Which suggests the use of photonics in a separate chip in, for example, a 3D-IC stack or on an interposer: one for routing signals between the chips in the stack.

That photonic chip would be made with the same equipment as a CMOS chip – a specific goal of the imec work in commercializing silicon photonics, but it starts with a different wafer: SOI, with a thinner silicon layer than you would have in a typical CMOS wafer, and with that thickness (or thinness) tightly controlled to reduce optical losses.

You can read more about imec’s progress in their recent announcement.

Leave a Reply

featured blogs
Jan 21, 2022
Here are a few teasers for what you'll find in this week's round-up of CFD news and notes. How AI can be trained to identify more objects than are in its learning dataset. Will GPUs really... [[ Click on the title to access the full blog on the Cadence Community si...
Jan 20, 2022
High performance computing continues to expand & evolve; our team shares their 2022 HPC predictions including new HPC applications and processor architectures. The post The Future of High-Performance Computing (HPC): Key Predictions for 2022 appeared first on From Silico...
Jan 20, 2022
As Josh Wardle famously said about his creation: "It's not trying to do anything shady with your data or your eyeballs ... It's just a game that's fun.'...

featured video

AI SoC Chats: Understanding Compute Needs for AI SoCs

Sponsored by Synopsys

Will your next system require high performance AI? Learn what the latest systems are using for computation, including AI math, floating point and dot product hardware, and processor IP.

Click here for more information about DesignWare IP for Amazing AI

featured paper

Using the MAX66242 Mobile Application, the Basics

Sponsored by Analog Devices

This application note describes the basics of the near-field communication (NFC)/radio frequency identification (RFID) MAX66242EVKIT board and an application utilizing the NFC capabilities of iOS and Android® based mobile devices to exercise board functionality. It then demonstrates how the application enables the user with the ability to use the memory and secure features of the MAX66242. It also shows how to use the MAX66242 with an onboard I2C temperature sensor which demonstrates the energy harvesting feature of the device.

Click to read more

featured chalk talk

Solutions for Heterogeneous Multicore

Sponsored by Siemens Digital Industries Software

Multicore processing is more popular than ever before but how do we take advantage of this new kind of processing? In this episode of Chalk Talk, Jeff Hancock from Siemens and Amelia Dalton investigate the challenges inherent in multicore processing, the benefits of hypervisors and multicore frameworks, and what you need to consider when choosing your next multicore processing solution.

Click here for more information about Multicore Enablement: Enabling today’s most advanced MPSoC systems